公开(公告)号：US20240010666A1

公开(公告)日：2024-01-11

申请号：US18342885

申请日：2023-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bumwoo Park ,  Ohyun Kwon ,  Virendra Kumar RAI ,  Byoungki Choi ,  Jungok Chu ,  Yasushi KOISHIKAWA

IPC: C07F19/00 ,  H10K50/11 ,  H10K85/30 ,  H10K50/81 ,  H10K50/82 ,  H10K50/15 ,  H10K50/16 ,  C09K11/06

CPC classification number: C07F19/00 ,  H10K50/11 ,  H10K85/342 ,  H10K50/81 ,  H10K50/82 ,  H10K50/15 ,  H10K50/16 ,  C09K11/06 ,  C09K2211/1048

Abstract: An organometallic compound represented by Formula 1:


M1(L1)n1(L2)n2  Formula 1

wherein, M1 is a transition metal, L1 is a ligand represented by Formula 1A, L2 is a ligand represented by Formula 1B, and n1 and n2 are each independently 1 or 2,




wherein X1 is C or N; X2 is C or N; X3 is C or N; X4 is C or N; ring CY1 and ring CY2 are each independently a C5-C30 carbocyclic group or a C1-C30 heterocyclic group; Z1 and Z2 are each independently —Si(Q1)(Q2)(Q3) or —Ge(Q1)(Q2)(Q3); a1 and a2 are each independently an integer from 0 to 10; a sum of a1 and a2 is 1 or greater; Y1 and Y2 are each independently O, S, Se, N(R51), B(R52), C(R53)(R54), Si(R55)(R56), or Ge(R57)(R58); and the remaining substituent groups are as described herein.

公开(公告)号：US20230329084A1

公开(公告)日：2023-10-12

申请号：US18298794

申请日：2023-04-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohyun Kwon ,  Bumwoo Park ,  Virendra Kumar RAI ,  Hyungjun Kim ,  Banglin Lee ,  Hwayoung Cho ,  Byoungki Choi

IPC: H10K85/30 ,  C07F15/00 ,  C09K11/06 ,  H10K85/40

CPC classification number: H10K85/342 ,  C07F15/0033 ,  C09K11/06 ,  H10K85/40 ,  H10K50/11

Abstract: An organometallic compound represented by Formula 1:


M1(L1)n1(L2)n2  Formula 1

wherein, M1 is a transition metal, L1 is a ligand represented by Formula 1A, L2 is a ligand represented by Formula 1B, and n1 and n2 are each independently 1 or 2,




wherein ring CY1, ring CY2, ring CY4, R1, R2, R4, R31, R32, X1 to X4, Y1, Z1, Z2, a1, a2, b1, b2, b31, b32, and b4 in Formulae 1A and 1B are respectively as described herein, and * and *′ each indicate a binding site to M1.

公开(公告)号：US20230136933A1

公开(公告)日：2023-05-04

申请号：US17686941

申请日：2022-03-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohyun Kwon ,  Virendra Kumar RAI ,  Bumwoo Park ,  Soyeon Kim ,  Yongsuk Cho ,  Byoungki Choi ,  Jongwon Choi

IPC: H01L51/00 ,  C07F15/00 ,  C09K11/06

Abstract: An organometallic compound represented by Formula 1: M1(Ln1)n1(Ln2)n2  Formula 1 wherein, in Formula 1, Ln1 is a ligand represented by Formula 1A, Ln2 is a ligand represented by Formula 1B, n1 is 1 or 2, and n2 is 1 or 2: wherein CY1 is a 6-membered N-containing heterocyclic group, a 6-membered N-containing heterocyclic group condensed with a C1-C30 carbocyclic group, or a 6-membered N-containing heterocyclic group condensed with a C5-C30 heterocyclic group, CY21 is a 5-membered carbocyclic group or a 5-membered heterocyclic group, X31 and X32 are each independently O or S, * and *′ each indicate a binding site to M1, and R10, R20 to R22, R31 to R37, b10, and b20 are as provided herein.

公开(公告)号：US20230136207A1

公开(公告)日：2023-05-04

申请号：US17686956

申请日：2022-03-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bumwoo Park ,  Ohyun Kwon ,  Virendra Kumar RAI ,  Sunghun Lee ,  Hwayoung Cho ,  Byoungki Choi

IPC: C07F15/00 ,  H01L51/00

Abstract: An organometallic compound, represented by Formula 1: M1(Ln1)n1(Ln2)n2   Formula 1 wherein Ln1 is a ligand represented by Formula 1A, Ln2 is a ligand represented by Formula 1B, n1 is 1 or 2, and n2 is 1 or 2: wherein, in Formulae 1, 1A, and 1B, X1 is C or N, X2 is C or N, CY1 and CY2 are each independently a C5-C30 carbocyclic group or a C1-C30 heterocyclic group, CY3 is a 6-membered N-containing heterocyclic group, a 6-membered N-containing heterocyclic group condensed with a C5-C30 carbocyclic group, or a 6-membered N-containing heterocyclic group condensed with a C5-C30 carbocyclic group or a C1-C30 heterocyclic group, CY41 is a 5-membered carbocyclic group or a 5-membered heterocyclic group, * and *′ each represent a bonding site to M1, and wherein R10, R20 to R30, R40 to R42, and b10 to b40 are as provided herein.

公开(公告)号：US20230122211A1

公开(公告)日：2023-04-20

申请号：US17685695

申请日：2022-03-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohyun Kwon ,  Virendra Kumar RAI ,  Bumwoo Park ,  Hyungjun Kim ,  Juhee Moon ,  Byoungki Choi

IPC: H01L51/00 ,  C07F15/00 ,  C09K11/06

Abstract: An organometallic compound, represented by Formula 1: M1(Ln1)n1(Ln2)n2  Formula 1 wherein, in Formula 1, Ln1 is a ligand represented by Formula 1A, Ln2 is a ligand represented by Formula 1B, n1 is 1 or 2, and n2 is 1 or 2: wherein X1, X2, Y1, Y2, Y3, Y4, Y5, Y6, Y7, Y8, Y9, Y10, CY1, CY2, CY3, T1, T2, a1, a2, R10, R20, R30, b10, b20, and b30 are each as described herein.

公开(公告)号：US20230118185A1

公开(公告)日：2023-04-20

申请号：US17683653

申请日：2022-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohyun Kwon ,  Virendra Kumar RAI ,  Bumwoo Park ,  Soyeon Kim ,  Yongsuk Cho ,  Hwayoung Cho ,  Byoungki Choi ,  Jongwon Choi

IPC: C07F15/00 ,  H01L51/00

Abstract: An organometallic compound, represented by Formula 1: M1(Ln1)n1(Ln2)n2  Formula 1 wherein, Ln1 is a ligand represented by Formula 1-1, Ln2 is a ligand represented by Formula 2-1 or Formula 2-2, n1 may be 1 or 2, and n2 may be 1 or 2, wherein the other substituents may be understood by referring to the descriptions thereof provided herein:

公开(公告)号：US20220131094A1

公开(公告)日：2022-04-28

申请号：US17511998

申请日：2021-10-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohyun Kwon ,  Virendra Kumar RAI ,  Bumwoo Park ,  Hyungjun Kim ,  Myungsun Sim ,  Byoungki Choi ,  Yasushi KOISHIKAWA

IPC: H01L51/00 ,  C07F15/00 ,  C09K11/06

Abstract: An organometallic compound represented by Formula 1: M1(Ln1)n1(Ln2)n2   Formula 1 wherein, Ln1 is a ligand represented by Formula 1A, Ln2 is a ligand represented by Formula 1B: wherein, in Formulae 1, 1A, and 1B, M1 is a transition metal, Ln1 is a ligand represented by Formula 1A, Ln2 is a ligand represented by Formula 1B, n1 is 0, 1, or 2, n2 is 1, 2, or 3, a1 is 0, 1, 2, or 3, k1 is 1, 2, 3, 4, 5, 6, 7, or 8, b10 and b20 are each independently 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, and * and *′ each represents a binding site to M1, and wherein CY1, CY2, X1, X2, Y1 to Y10, L1, Ar1, R1, R2, R10, and R20 are as provided herein.

公开(公告)号：US20150194614A1

公开(公告)日：2015-07-09

申请号：US14460407

申请日：2014-08-15

Applicant: Samsung Electronics Co., Ltd. ,  CHEIL INDUSTRIES INC.

Inventor： Dmitry KRAVCHUK ,  Chang-ho NOH ,  Rupasree Ragini DAS ,  Virendra Kumar RAI ,  Kang-mun LEE

IPC: H01L51/00

CPC classification number: H01L51/0085 ,  C07F15/0033 ,  C09K11/06 ,  C09K2211/1007 ,  C09K2211/1029 ,  C09K2211/1044 ,  C09K2211/1059 ,  C09K2211/1088 ,  C09K2211/1092 ,  C09K2211/185 ,  H01L51/5016 ,  H01L2251/308

Abstract: An organometallic compound represented by Formula 1: M(L1)n1(L2)n2  Formula 1 wherein in Formula 1, M, L1, L2, n1, and n2 are the same as described in the specification.

Abstract translation: 由式1表示的有机金属化合物：M（L1）n1（L2）n2式1其中在式1中，M，L1，L2，n1和n2与说明书中描述的相同。

公开(公告)号：US20240324438A1

公开(公告)日：2024-09-26

申请号：US18613454

申请日：2024-03-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohyun Kwon ,  Bumwoo Park ,  Virendra Kumar RAI ,  Myungsun Sim ,  Yong Joo Lee

IPC: H10K85/30 ,  C07F15/00 ,  C09K11/06 ,  H10K50/12 ,  H10K85/40

CPC classification number: H10K85/342 ,  C07F15/0033 ,  C09K11/06 ,  H10K85/40 ,  C07B2200/05 ,  C09K2211/1048 ,  C09K2211/185 ,  H10K50/12

Abstract: An organometallic compound represented by Formula 1:


M1(L1)n1(L2)n2  Formula 1

wherein, M1 is a transition metal, L1 is a ligand represented by Formula 1A, L2 is a ligand represented by Formula 1B, and n1 and n2 are each independently 1 or 2:




with the proviso that i) X43 is C linked to Y2 in Formula 2 and X44 is C linked to Y3 in Formula 2; ii) X44 is C linked to Y2 in Formula 2 and X45 is C linked to Y3 in Formula 2; or iii) X45 is C linked to Y2 in Formula 2 and X46 is C linked to Y5 in Formula 2; wherein the remaining substituent groups of Formulae 1A, 1B, and 2 are as provided herein.

公开(公告)号：US20230126171A1

公开(公告)日：2023-04-27

申请号：US18047418

申请日：2022-10-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohyun Kwon ,  Bumwoo Park ,  Soyeon Kim ,  Virendra Kumar RAI ,  Yongsuk Cho ,  Byoungki Choi ,  Jongwon Choi

IPC: C07F15/00 ,  H01L51/00

Abstract: An organometallic compound, represented by Formula 1: M1(Ln1)n1(Ln2)n2  Formula 1 wherein Ln1 is a ligand represented by Formula 1A, Ln2 is a ligand represented by Formula 1B, n1 is 1 or 2, and n2 is 1 or 2: wherein ring CY21 is a 5-membered carbocyclic group or a 5-membered heterocyclic group, X31 and X32 are each independently O or S, b20 is an integer from 0 to 6, R11 to R18, R20 to R22, and R31 to R37 are as defined herein, and * and *′ each indicates a binding site to M1.