Abstract:
A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a plurality of first chip bumps between the first package substrate and the first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, a molding member which covers the plurality of second semiconductor chips, on the first semiconductor chip, and a thermoelectric cooling layer attached onto a surface of the first semiconductor chip. The thermoelectric cooling layer includes a cooling material layer extending along the surface of the first semiconductor chip, a first electrode pattern which surrounds the plurality of first chip bumps from a planar viewpoint, in the cooling material layer, and a second electrode pattern which surrounds the first electrode pattern from the planar viewpoint, in the cooling material layer.
Abstract:
An apparatus and method for stabilizing an output of a laser is provided. An optical amplifier oscillates light having a first wavelength band. A filter filters the light having the first wavelength band to output light having a second wavelength band narrower than the first wavelength band. The light having the second wavelength band may correspond to an output of a laser. To stabilize the wavelength center of the output laser, at least a portion of the light having the second wavelength band may be transferred to a fiber Bragg Grating (FBG) through a coupler. By performing feedback of a difference between the signal output from the FBG and a laser modulation signal, an offset corresponding to a lead zirconate titanate (PZT) operating parameter of a Fabry-Perot filter may be controlled to automatically stabilize the wavelength center.