公开(公告)号：US11062940B2

公开(公告)日：2021-07-13

申请号：US16442936

申请日：2019-06-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang-Woo Sun ,  Ji-Eun Yun ,  Jae-Soon Lim ,  Youn-Joung Cho ,  Myong-Woon Kim ,  Kang-yong Lee ,  Sang-Ick Lee ,  Sung-Woo Cho

IPC: C23C16/455 ,  H01L21/768 ,  C07F17/00 ,  C23C16/18 ,  C23C16/34 ,  C07F11/00 ,  H01L21/285 ,  H01L27/108 ,  H01L27/11582 ,  H01L49/02

Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.

公开(公告)号：US20180102284A1

公开(公告)日：2018-04-12

申请号：US15498945

申请日：2017-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang-Woo Sun ,  Ji-Eun Yun ,  Jae-Soon Lim ,  Youn-Joung Cho ,  Myong-Woon Kim ,  Kang-Yong Lee ,  Sang-Ick Lee ,  Sung-Woo Cho

IPC: H01L21/768 ,  H01L21/285 ,  C07F11/00

CPC classification number: H01L21/76841 ,  C07F11/00 ,  C07F17/00 ,  C23C16/18 ,  C23C16/34 ,  C23C16/45553 ,  H01L21/28562 ,  H01L21/76843 ,  H01L27/1085 ,  H01L27/11582 ,  H01L28/60

Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.

公开(公告)号：US10361118B2

公开(公告)日：2019-07-23

申请号：US15498945

申请日：2017-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang-Woo Sun ,  Ji-Eun Yun ,  Jae-Soon Lim ,  Youn-Joung Cho ,  Myong-Woon Kim ,  Kang-Yong Lee ,  Sang-Ick Lee ,  Sung-Woo Cho

IPC: H01L21/768 ,  C07F11/00 ,  H01L21/285 ,  C07F17/00

Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.

公开(公告)号：US20130166660A1

公开(公告)日：2013-06-27

申请号：US13725857

申请日：2012-12-21

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Yong-Su Chung ,  Young-Sup Shin ,  Sung-Jun Lim ,  Sung-Woo Cho

IPC: H04L12/58

CPC classification number: H04L51/08 ,  H04L51/10 ,  H04L51/38

Abstract: An apparatus and method list and manage information about an attached file of a multimedia message in a portable terminal. An apparatus for managing a message in a portable terminal includes a communication unit for transmitting/receiving a message including an attached file, a display unit for displaying a message transmission process and a content of an attached file included in a message, a message analyzing unit for acquiring an attached file from a message including an attached file, a file list generating unit for generating an attached file list about an acquired attached file, and a control unit for performing control to display an attached file list.

Abstract translation: 装置和方法在便携式终端中列出并管理关于多媒体消息的附加文件的信息。 一种用于在便携式终端中管理消息的装置包括用于发送/接收包括附件的消息的通信单元，用于显示消息发送处理的显示单元和包括在消息中的附加文件的内容，消息分析单元 用于从包括附件的消息中获取附加文件，文件列表生成单元，用于生成关于所获取的附加文件的附加文件列表;以及控制单元，用于执行显示附加文件列表的控制。