公开(公告)号：US20250137123A1

公开(公告)日：2025-05-01

申请号：US18830845

申请日：2024-09-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungmin PARK ,  Haeryong KIM ,  Boeun PARK ,  Jeongil BANG ,  Jooho LEE ,  Hanjin LIM ,  Hyungsuk JUNG ,  Sumin HWANG

IPC: C23C16/455 ,  C23C16/40 ,  C23C16/44 ,  H01L27/06 ,  H10B12/00

Abstract: A method of manufacturing a multi-component thin film includes providing a substrate into a process chamber, performing a first cycle, the first cycle including forming a first atomic layer including a first precursor on the substrate by using an atomic layer deposition process, performing a third cycle, the third cycle including injecting an additive onto the first atomic layer, and performing a second cycle, the second cycle including forming a second atomic layer including a second precursor on the first atomic layer and the additive by using an atomic layer deposition process, wherein a thermal decomposition temperature of the additive is lower than each of a thermal decomposition temperature of the first precursor and a thermal decomposition temperature of the second precursor.