公开(公告)号：US12057408B2

公开(公告)日：2024-08-06

申请号：US17171475

申请日：2021-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chulwoo Kim ,  Yanggyoo Jung ,  Soohyun Nam

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/562 ,  H01L23/16 ,  H01L23/3185 ,  H01L23/3675 ,  H01L23/49838 ,  H01L24/16 ,  H01L25/0652 ,  H01L2224/16227 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/18161 ,  H01L2924/3511

Abstract: A semiconductor package includes a substrate including a wiring, a semiconductor chip structure on the substrate, and electrically connected to the wiring, an underfill resin in a space between the substrate and the semiconductor chip structure, and a stiffener surrounding the semiconductor chip structure, on the substrate, wherein the stiffener includes a conductive frame having a cavity and an insulating filler in the cavity.

公开(公告)号：US12033973B2

公开(公告)日：2024-07-09

申请号：US17367995

申请日：2021-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soohyun Nam ,  Younglyong Kim

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L24/73 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/16235 ,  H01L2224/32056 ,  H01L2224/32059 ,  H01L2224/32235 ,  H01L2224/73204 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1815 ,  H01L2924/182 ,  H01L2924/3512

Abstract: A semiconductor package including an interposer substrate, first to third semiconductor chips on the interposer substrate to face each other, an underfill part between each of the first to third semiconductor chips and the interposer substrate, a first side-fill part extending upward from a lower end of side walls of the first to third semiconductor chips, and a second side-fill part between the side walls of the first to third semiconductor chips and extending from the first side-fill part to an upper end of the side walls of the first to third semiconductor chips may be provided.

公开(公告)号：US20220013475A1

公开(公告)日：2022-01-13

申请号：US17171475

申请日：2021-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chulwoo Kim ,  Yanggyoo Jung ,  Soohyun Nam

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/16 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498

Abstract: A semiconductor package includes a substrate including a wiring, a semiconductor chip structure on the substrate, and electrically connected to the wiring, an underfill resin in a space between the substrate and the semiconductor chip structure, and a stiffener surrounding the semiconductor chip structure, on the substrate, wherein the stiffener includes a conductive frame having a cavity and an insulating filler in the cavity.