公开(公告)号：US20250132203A1

公开(公告)日：2025-04-24

申请号：US18758118

申请日：2024-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Song Yi BAEK ,  Geumbi MUN ,  Junga LEE ,  Okran KIM ,  Seyoung HWANG ,  Kyoungchul SHIN ,  Sungsoo YANG ,  Daekwang WOO

IPC: H01L21/768 ,  H01L21/311 ,  H01L21/3213

Abstract: A method for manufacturing a semiconductor device. The method may include forming an insulating interlayer on a substrate, forming tungsten patterns inside and on the insulating interlayer, forming an insulation pattern on the insulating interlayer to fill a space between the tungsten patterns, and the insulation pattern having a lowest point of an upper surface lower than an upper surface of each of the tungsten patterns, forming a preliminary tungsten oxide layer on the upper surface of each of the tungsten patterns, performing a first surface plasma treatment on the preliminary tungsten oxide layer to remove at least a portion of the preliminary tungsten oxide layer to form a tungsten oxide layer and a protective layer on the tungsten oxide layer, and forming an etch stop layer on the protective layer and the insulation pattern.

公开(公告)号：US20240278166A1

公开(公告)日：2024-08-22

申请号：US18434923

申请日：2024-02-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Song Yi BAEK ,  Jae Hyun KIM ,  Hwan Soo HEO ,  Dae Wee KONG ,  Sang Ho ROH

IPC: B01D53/00 ,  B01D53/34 ,  B01D53/46 ,  B01D53/76

CPC classification number: B01D53/007 ,  B01D53/346 ,  B01D53/46 ,  B01D53/76 ,  B01D2251/102 ,  B01D2258/0216 ,  B01D2259/10 ,  B01D2259/804

Abstract: A carbon byproduct removal module includes: a vaporizer configured to produce vapor including oxygen atoms; a carrier gas supplier connected to the vaporizer and configured to supply carrier gas to the vaporizer, wherein the carrier gas carries the vapor to a UV-ray irradiator; and the UV-ray irradiator configured to emit ultraviolet rays to the vapor, wherein a first end of the UV-ray irradiator is connected to a first end of the vaporizer, wherein a second end of the UV-ray irradiator is attached to an exhaust module connected to a chamber in which a semiconductor manufacturing process is performed.