Wearable electronic device including heat dissipation structure

    公开(公告)号:US12284795B2

    公开(公告)日:2025-04-22

    申请号:US18904209

    申请日:2024-10-02

    Abstract: A wearable electronic device according to an embodiment may include: a housing disposed and configured to face a user's face, a first display including a display disposed inside the housing and configured to provide visual information to corresponding one of the user's eyes, a first heat dissipation fan disposed to at least partially face the first display and configured to discharge air inside the housing to an outside of the housing, a first heat conductive member comprising a thermally conductive material configured to absorb, dissipate, and/or move heat from the first display, a first heat dissipation fin provided at one end portion of the first heat conductive member and disposed on a movement path of the air discharged by the first heat dissipation fan, a second heat dissipation fan disposed to at least partially face the first display and configured to discharge the air inside the housing to the outside of the housing, a second heat conductive member comprising a thermally conductive material configured to absorb, dissipate, and/or move heat from the second display, and a second heat dissipation fin provided at one end portion of the second heat conductive member and disposed on a movement path of the air discharged by the second heat dissipation fan.

    Wearable electronic device including heat dissipation structure

    公开(公告)号:US11864364B2

    公开(公告)日:2024-01-02

    申请号:US17674302

    申请日:2022-02-17

    CPC classification number: H05K7/20963 G02B27/0176 G06F1/163 G02B2027/0178

    Abstract: A wearable electronic device is provided. The wearable electronic device includes a housing including a first portion constituting a first outer surface of the wearable electronic device and a second portion constituting a second outer surface of the wearable electronic device, at least one electronic component positioned in an inner space of the housing and configured to emit heat, and multiple support structures which are at least partially positioned to correspond to the at least one electronic component between the first portion and the second portion, wherein a boundary part between the first portion and the second portion is at least partially positioned along a surface boundary between the first outer surface and the second outer surface and includes at least one opening, and an at least one distancing space between the multiple support structures is configured to communicate with an outer space of the housing through the at least one opening.

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