知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

30 records (took 0.015 seconds)

    Electronic device and method for controlling the electronic device
    1.
    发明授权
    Electronic device and method for controlling the electronic device 有权

    公开(公告)号：US10250820B2

    公开(公告)日：2019-04-02

    申请号：US15497576

    申请日：2017-04-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hong-Suk Choi ,  Jung-Hoon Kim ,  Ki-Huk Lee

    IPC: H04N5/265 ,  G06T7/11 ,  H04N5/225

    Abstract: An electronic device and a method for controlling thereof are provided. The device includes a light emitter, an image sensor including first pixels controlled based on a first parameter and second pixels controlled based on a second parameter, a sensor, and a processor. The processor detects a first object and a second object in an image area, determines the first and second parameters based on a first property of the first object and a second property of the second object, said determination is based on a light intensity that is outputted from the light emitter and reflected by the first and second objects, acquires a first image of the first object according to the first parameter and a second image of the second object according to the second parameter, and synthesizes a first area corresponding to the first object with a second area corresponding to the second object.

    Semiconductor device
    2.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US09504138B2

    公开(公告)日：2016-11-22

    申请号：US14446289

    申请日：2014-07-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jung-Hoon Kim ,  Jin-Hyuk Lee

    IPC: H05K1/02 ,  H01L23/52 ,  H01L23/36 ,  H05K1/18

    CPC classification number: H05K1/0207 ,  H01L23/36 ,  H01L23/52 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10371 ,  H05K2201/10416 ,  H01L2924/00

    Abstract: Embodiments of the inventive concept include a semiconductor device having a circuit board including a first outer layer, a contact region in the first outer layer, a second layer formed on an opposite side of the first outer layer, a via-hole, and a plurality of inner layers formed to be stacked between the first layer and the second layer. A case may accommodate the circuit board. The case may have a projection portion that is configured to come in contact with the circuit board in the contact region. The plurality of inner layers may include a ground layer. The first outer layer may be connected to the ground layer through a via-hole. The case may be connected to the ground layer through the first outer layer.

    Abstract translation: 本发明构思的实施例包括具有电路板的半导体器件，该电路板包括第一外层，第一外层中的接触区域，形成在第一外层的相对侧上的第二层，通孔和多个 的内层被形成为堆叠在第一层和第二层之间。 一个案例可以容纳电路板。 壳体可以具有突出部分，其被配置为在接触区域中与电路板接触。 多个内层可以包括接地层。 第一外层可以通过通孔连接到接地层。 壳体可以通过第一外层连接到接地层。

Patent Agency Ranking