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公开(公告)号：US11109144B2
公开(公告)日：2021-08-31
申请号：US16662811
申请日：2019-10-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seonguk Park , Kyungmoon Kang , Juhwan Kim , Hyunsuk Choi
Abstract: An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate, and a lateral member surrounding a space between the front and rear plates and having at least one through-hole. The electronic device further includes a display disposed to be seen through the front plate, and a speaker structure disposed near the through-hole in the space between the display and the rear plate. The speaker structure includes a yoke disposed between the display and the rear plate and facing the display, a diaphragm disposed between the rear plate and the yoke and spaced apart from the rear plate, a magnet disposed between the yoke and the diaphragm, a speaker housing surrounding, at least in part, at least one of the diaphragm, the yoke, or the magnet and including a first opening formed toward the rear plate and a second opening formed toward the through-hole. The electronic device further includes a sealing member disposed between the speaker housing and the rear plate and surrounding the first opening when viewed from the rear plate. A sound conduit includes, between the diaphragm and the through-hole, a first space formed by the first opening, the rear plate, and the sealing member, and a second space connected to the first space through the second opening.
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公开(公告)号：US20220408170A1
公开(公告)日：2022-12-22
申请号：US17838970
申请日：2022-06-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seonguk Park , Taeuk Kang , Juhwan Kim , Jiwoo Lee
Abstract: Disclosed is an electronic device including a structure that stably supports a flexible printed circuit board on which a microphone module is disposed inside the electronic device, thereby improving the sealing between the microphone module and the camera housing.
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公开(公告)号：US11882393B2
公开(公告)日：2024-01-23
申请号：US17838970
申请日：2022-06-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seonguk Park , Taeuk Kang , Juhwan Kim , Jiwoo Lee
CPC classification number: H04R1/04 , H04N23/51 , H04R1/08 , H04R1/2876 , H04R3/00 , H04M1/0277 , H04R2499/11
Abstract: Disclosed is an electronic device including a structure that stably supports a flexible printed circuit board on which a microphone module is disposed inside the electronic device, thereby improving the sealing between the microphone module and the camera housing.
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公开(公告)号：US11076221B2
公开(公告)日：2021-07-27
申请号：US16662811
申请日：2019-10-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seonguk Park , Kyungmoon Kang , Juhwan Kim , Hyunsuk Choi
Abstract: An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate, and a lateral member surrounding a space between the front and rear plates and having at least one through-hole. The electronic device further includes a display disposed to be seen through the front plate, and a speaker structure disposed near the through-hole in the space between the display and the rear plate. The speaker structure includes a yoke disposed between the display and the rear plate and facing the display, a diaphragm disposed between the rear plate and the yoke and spaced apart from the rear plate, a magnet disposed between the yoke and the diaphragm, a speaker housing surrounding, at least in part, at least one of the diaphragm, the yoke, or the magnet and including a first opening formed toward the rear plate and a second opening formed toward the through-hole. The electronic device further includes a sealing member disposed between the speaker housing and the rear plate and surrounding the first opening when viewed from the rear plate. A sound conduit includes, between the diaphragm and the through-hole, a first space formed by the first opening, the rear plate, and the sealing member, and a second space connected to the first space through the second opening.
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