公开(公告)号：US20250120211A1

公开(公告)日：2025-04-10

申请号：US18767607

申请日：2024-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaesang Yoo ,  Younguk Song ,  Minwook Jung ,  Kiho Jung ,  Namgi Hong

IPC: H01L27/146

Abstract: An image sensor includes photoelectric conversion devices provided in a substrate comprising first and second surfaces, first and second photoelectric conversion elements in the substrate, first and second separation structures in the substrate, first and second grid structures on the first and second separation structures. The second photoelectric conversion element is disposed between the first separation structure and the second separation structure. The first and second grid structure are vertically overlapping with the first and second separation structure. The first grid structure comprises an air gap and N plurality of layers on an external side surface of the air gap. Each of the N plurality of layers extends in a first direction. The second grid structures comprises M plurality of layers on an external side surface of the second grid structure and extends in the first direction.

公开(公告)号：US09825081B2

公开(公告)日：2017-11-21

申请号：US15229265

申请日：2016-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeseok Oh ,  Junetaeg Lee ,  Seung-Hun Shin ,  Jaesang Yoo

IPC: H01L31/0232 ,  H01L27/146 ,  H01L23/48 ,  H01L25/065 ,  H01L23/532

CPC classification number: H01L27/14636 ,  H01L21/187 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53266 ,  H01L25/0657 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/1469

Abstract: A semiconductor device includes a substrate, a circuit layer formed on a first surface of the substrate and including a via pad and an interlayer insulating layer covering the via pad, a via structure configured to fully pass through the substrate, partially pass through the interlayer insulating layer and be in contact with the via pad, a via isolation insulating layer configured to pass through the substrate and be spaced apart from outer side surfaces of the via structure in a horizontal direction and a pad structure buried in the substrate and exposed on a second surface of the substrate opposite the first surface of the substrate.