公开(公告)号：US10608324B2

公开(公告)日：2020-03-31

申请号：US15720872

申请日：2017-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Ha Lee ,  Kyung Jae Lee ,  Jae Ho Lim ,  Dong Hwan Kim ,  Young Jun Kim ,  Un Kim ,  Jong Hoon Kim ,  Min Seok Park

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q13/10 ,  H01Q5/328 ,  H01Q9/04 ,  H01Q5/35 ,  H01Q5/40 ,  H01Q9/42

Abstract: An electronic device includes a metal housing, a conductive member disposed adjacent to the metal housing, a plurality of ground parts including a first ground part electrically connected with a first point of the conductive member and a second ground part electrically connected with a second point of the conductive member, a ground plate electrically connected with the metal housing and electrically connected with the conductive member via the plurality of ground parts, and a feeding part electrically connected with the conductive member.