公开(公告)号：US20230072616A1

公开(公告)日：2023-03-09

申请号：US17697243

申请日：2022-03-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeohoon YOON ,  Ilho KIM

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip spaced apart from the first semiconductor chip, an adhesive layer including an interposition portion and a side portion, and a molding layer. The molding layer may surround the first semiconductor chip, the second semiconductor chip, and the adhesive layer. The interposition portion may be between the first and second semiconductor chips. The side portion may contact a side surface of the first semiconductor chip and a side surface of the second semiconductor chip. A top surface of the side portion is curved, and an outer side surface of the side portion is flat.

公开(公告)号：US20170243763A1

公开(公告)日：2017-08-24

申请号：US15345534

申请日：2016-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonseok CHOI ,  Ilho KIM ,  Changho KIM

IPC: H01L21/56 ,  H01L23/00 ,  H01L21/683

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/373 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68318 ,  H01L2221/68386 ,  H01L2224/02331 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2924/3511

Abstract: A support substrate, a method of manufacturing a semiconductor package, and a semiconductor package, the support substrate including a first plate; a second plate on the first plate; and an adhesive layer between the first plate and the second plate, wherein a coefficient of thermal expansion (CTE) of the adhesive layer is higher than a CTE of the first plate and higher than a CTE of the second plate.

公开(公告)号：US20250125271A1

公开(公告)日：2025-04-17

申请号：US19001810

申请日：2024-12-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeohoon YOON ,  Ilho KIM

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip spaced apart from the first semiconductor chip, an adhesive layer including an interposition portion and a side portion, and a molding layer. The molding layer may surround the first semiconductor chip, the second semiconductor chip, and the adhesive layer. The interposition portion may be between the first and second semiconductor chips. The side portion may contact a side surface of the first semiconductor chip and a side surface of the second semiconductor chip. A top surface of the side portion is curved, and an outer side surface of the side portion is flat.

公开(公告)号：US20250047997A1

公开(公告)日：2025-02-06

申请号：US18791997

申请日：2024-08-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilho KIM

IPC: H04N25/71 ,  H04N5/06 ,  H04N25/701

Abstract: A method of operating a line buffer controller includes receiving pieces of line image data included in an image frame, and, when all pieces of line image data included in the image frame are received, performing a drain operation on the image frame based on a maximum standby count of the image frame.