公开(公告)号：US11388277B2

公开(公告)日：2022-07-12

申请号：US16985516

申请日：2020-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taewoo Kim ,  Dui Kang ,  Bongkyu Min ,  Bongchoon Park ,  Sanghoon Park ,  Jinyong Park ,  Hyelim Yun ,  Hyeongju Lee ,  Younoh Chi

IPC: H05K1/02 ,  H04M1/02 ,  H05K1/18 ,  H05K1/11

Abstract: An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.