公开(公告)号：US20230146085A1

公开(公告)日：2023-05-11

申请号：US17840744

申请日：2022-06-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon KANG ,  Byungmin YU ,  Junghyun LEE

IPC: H01L25/10 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L23/5385 ,  H01L2224/16227 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/81399 ,  H01L24/05 ,  H01L24/13 ,  H01L24/81

Abstract: A semiconductor package includes: a lower redistribution structure including a lower redistribution insulation layer, a bump pad in the lower redistribution insulation layer, and a lower redistribution pattern electrically connected to the bump pad, wherein the lower redistribution insulation layer includes: one or more sidewalls at least partially defining a cavity extending from a bottom surface of the lower redistribution insulation layer to an upper surface of the lower redistribution insulation layer; a passive component in the cavity of the lower redistribution insulation layer; an insulation filler in the cavity of the lower redistribution insulation layer, the insulation filler covering sidewalls of the passive component; a first semiconductor chip on the lower redistribution structure, the first semiconductor chip electrically connected to both the lower redistribution pattern and the passive component; and an external connection bump connected to the bump pad via a pad opening of the lower redistribution insulation layer.