公开(公告)号：US12014905B2

公开(公告)日：2024-06-18

申请号：US17380806

申请日：2021-07-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nam Kyun Kim ,  Tae-Sun Shin ,  Deokjin Kwon ,  Donghyeon Na ,  Seungbo Shim ,  Sungyong Lim ,  Minjoon Kim ,  Jin Young Bang ,  Bongju Lee ,  Jinseok Lee ,  Sungil Cho ,  Chungho Cho

IPC: H01J37/32 ,  H01L21/26 ,  H01L21/683

CPC classification number: H01J37/32669 ,  H01J37/32146 ,  H01J37/3244 ,  H01J37/3266 ,  H01J37/32715 ,  H01L21/26 ,  H01L21/6831 ,  H01J2237/327

Abstract: A method of fabricating a semiconductor device include; seating a substrate having a substrate radius on an electrostatic chuck, applying first radio-frequency power to the electrostatic chuck to induce plasma in a region at least above the electrostatic chuck, and generating a magnetic field in the region at least above the electrostatic chuck using a magnet having a ring-shape and disposed above the electrostatic chuck by applying second radio-frequency power to the magnet, wherein the magnet has an inner radius ranging from about one-half to about one-fourth of the substrate radius.

公开(公告)号：US20240149314A1

公开(公告)日：2024-05-09

申请号：US18213853

申请日：2023-06-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunwoo Noh ,  Kyoungwoo Kim ,  Youngseok Jung ,  Youngjin Hong ,  Soochan Oh ,  Sungwoo Shin ,  Namhoon Lee ,  Bongju Lee

IPC: B08B13/00 ,  B08B1/00 ,  B08B1/04 ,  B08B3/02

CPC classification number: B08B13/00 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02

Abstract: Provided is a substrate processing apparatus configured to process a substrate having a notch including a plurality of rollers contacting a circumference of the substrate and configured to rotate the substrate, a first sensor configured to sense an impact between the plurality of rollers and the substrate, and a signal processing unit configured to detect revolutions per unit time of the substrate, based on a first sensing signal output by the first sensor.