Mask for deposition
    2.
    发明授权

    公开(公告)号:US12103024B2

    公开(公告)日:2024-10-01

    申请号:US17878480

    申请日:2022-08-01

    CPC classification number: B05B12/28 B05C21/005

    Abstract: A deposition mask including a resin film including first holes, a non-resin layer disposed on the resin film and including second holes corresponding to the first holes, and a protective layer disposed on the non-resin layer and including third holes corresponding to the first holes, wherein the protective layer includes a first portion disposed on a top surface of the non-resin layer, and a second portion covering a side surface of the second holes of the non-resin layer.

    Deposition mask and method of manufacturing the deposition mask

    公开(公告)号:US11345988B2

    公开(公告)日:2022-05-31

    申请号:US16674997

    申请日:2019-11-05

    Abstract: A method of manufacturing a deposition mask includes preparing a mask-target substrate which has one surface on which a sacrificed layer pattern is formed and comprises a cover area covered by the sacrificed layer pattern and a plurality of exposed areas exposed by the sacrificed layer pattern; forming holes in the exposed areas of the mask-target substrate by emitting laser toward the mask-target substrate; and removing the sacrificed layer pattern, wherein the sacrificed layer pattern has a higher reflectance with respect to the laser than a reflectance of the mask-target substrate.

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