公开(公告)号：US20240188405A1

公开(公告)日：2024-06-06

申请号：US18436887

申请日：2024-02-08

Applicant: Samsung Display Co., Ltd.

Inventor： KISANG YOO ,  KYUNGROK KO ,  YOUNGSU KIM ,  JAESUK YOO ,  JEONG-SEOP CHOI

IPC: H10K71/00 ,  B32B37/00 ,  B32B38/18 ,  H10K50/84 ,  H10K59/12 ,  H10K102/00

CPC classification number: H10K71/00 ,  B32B37/003 ,  B32B37/0046 ,  B32B38/1866 ,  H10K50/841 ,  B32B2457/20 ,  H10K59/12 ,  H10K2102/311 ,  Y10T156/1028

Abstract: A bonding device includes: a support in which a plurality of through-holes is defined, a diaphragm disposed on the support to cover the support, a pressing pad disposed on the diaphragm over a top surface of the support, and a window fixing chuck disposed on the pressing pad and in which a groove facing the pressing pad is defined. Here, the pressing pad includes a pad and at least one support bar disposed in the pad and extending in a first direction.

公开(公告)号：US20210384479A1

公开(公告)日：2021-12-09

申请号：US17188744

申请日：2021-03-01

Applicant: Samsung Display Co., LTD.

Inventor： JUNGKYU LEE ,  YOUNGSU KIM ,  JONGDEOK PARK ,  JAESUK YOO ,  JEONG-SEOP CHOI

IPC: H01L51/56 ,  B29C65/00

Abstract: A bonding device includes a first panel support, a second panel support disposed below the first panel support, a diaphragm disposed on and extending along the first panel support, the diaphragm being disposed between the first panel support and the second panel support, and a window fixing chuck disposed on the diaphragm, the window fixing chuck including a groove facing the diaphragm. A through-hole extends from the second panel support to the first panel support, and the diaphragm is disposed on the through-hole.

公开(公告)号：US20220077435A1

公开(公告)日：2022-03-10

申请号：US17355612

申请日：2021-06-23

Applicant: Samsung Display Co., Ltd.

Inventor： KISANG YOO ,  KYUNGROK KO ,  YOUNGSU KIM ,  JAESUK YOO ,  JEONG-SEOP CHOI

IPC: H01L51/56 ,  H01L51/52

Abstract: A bonding device includes: a support in which a plurality of through-holes is defined, a diaphragm disposed on the support to cover the support, a pressing pad disposed on the diaphragm over a top surface of the support, and a window fixing chuck disposed on the pressing pad and in which a groove facing the pressing pad is defined. Here, the pressing pad includes a pad and at least one support bar disposed in the pad and extending in a first direction.

公开(公告)号：US20240365650A1

公开(公告)日：2024-10-31

申请号：US18764798

申请日：2024-07-05

Applicant: Samsung Display Co., LTD.

Inventor： JUNGKYU LEE ,  YOUNGSU KIM ,  JONGDEOK PARK ,  JAESUK YOO ,  JEONG-SEOP CHOI

IPC: H10K71/00 ,  B29C65/00 ,  B29L31/34

CPC classification number: H10K71/00 ,  B29C66/81455 ,  B29L2031/3475

Abstract: A bonding device includes a first panel support, a second panel support disposed below the first panel support, a diaphragm disposed on and extending along the first panel support, the diaphragm being disposed between the first panel support and the second panel support, and a window fixing chuck disposed on the diaphragm, the window fixing chuck including a groove facing the diaphragm. A through-hole extends from the second panel support to the first panel support, and the diaphragm is disposed on the through-hole.