公开(公告)号：US10998362B2

公开(公告)日：2021-05-04

申请号：US16915274

申请日：2020-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hyun Lim ,  Yoon Seok Seo ,  Kyung Moon Jung ,  Eun Jin Kim

IPC: H01L27/146 ,  H01L31/0203 ,  H01L31/0232

Abstract: A fan-out sensor package includes: a substrate in which a through-hole is formed and portions of a wiring layer are exposed from an insulating layer; an image sensor having an active surface having a sensing region disposed below the through-hole of the substrate and connection pads disposed in the vicinity of the sensing region; an optical member disposed on the active surface of the image sensor; a dam member disposed in the vicinity of the sensing region; and an encapsulant encapsulating the substrate and the image sensor, wherein the third wiring layer and the connection pads are electrically connected to each other by connection members.

公开(公告)号：US10700110B2

公开(公告)日：2020-06-30

申请号：US16132757

申请日：2018-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hyun Lim ,  Yoon Seok Seo ,  Kyung Moon Jung ,  Eun Jin Kim

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0232

Abstract: A fan-out sensor package includes: a substrate in which a through-hole is formed and portions of a wiring layer are exposed from an insulating layer; an image sensor having an active surface having a sensing region disposed below the through-hole of the substrate and connection pads disposed in the vicinity of the sensing region; an optical member disposed on the active surface of the image sensor; a dam member disposed in the vicinity of the sensing region; and an encapsulant encapsulating the substrate and the image sensor, wherein the third wiring layer and the connection pads are electrically connected to each other by connection members.

公开(公告)号：US10573589B2

公开(公告)日：2020-02-25

申请号：US16105289

申请日：2018-08-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun Jin Kim ,  Han Kim

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/043

Abstract: A semiconductor package includes a connection member having a first surface and a second surface disposed to oppose each other and including an insulating member having a plurality of insulating layers and a plurality of redistribution layers disposed on the plurality of insulating layers, respectively; a semiconductor chip disposed on the first surface of the connection member and having connection pads electrically connected to the plurality of redistribution layers; and an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, wherein at least one of the plurality of redistribution layers includes a dummy electrode pattern in which a plurality of holes are arranged, and each of the plurality of holes has a shape including a plurality of protruding regions that protrude externally from different positions.