公开(公告)号：US20210309316A1

公开(公告)日：2021-10-07

申请号：US17271807

申请日：2019-08-29

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Jing GUO ,  Maria SOLIMAN ,  Mahari TJAHJADI ,  Chaodong JIANG ,  Christelle Marie Helene GREIN ,  Ratnesh KHANDELWAL

IPC: B62K19/16 ,  C08J5/04 ,  C08K7/14 ,  B29C45/00 ,  B29B9/06 ,  B29B9/14

Abstract: The invention relates to a bicycle frame made by injection molding pellets of a long glass fibre reinforced polypropylene composition having a core containing glass fibres and an impregnating agent and a sheath of polypropylene surrounding said core, wherein the pellets have an average length of at least 1 mm, the amount of the glass fibers is 10 to 70 wt % with respect to the composition and the polypropylene has a flexural modulus determined according to ASTM D790A of at least 1000 N/mm2.

公开(公告)号：US20170367182A1

公开(公告)日：2017-12-21

申请号：US15535087

申请日：2015-12-08

Applicant: SABIC Global Technologies B.V.

Inventor： Tong WU ,  Wei FENG ,  Yangang YAN ,  Wenjia Zhang ,  Yuxian AN ,  Xueming Lian ,  Mahari TJAHJADI

IPC: H05K1/03 ,  C08K9/02 ,  C08K5/00 ,  C08K3/22 ,  B32B27/36 ,  H05K3/18 ,  B32B27/20

CPC classification number: H05K1/0373 ,  B32B27/20 ,  B32B27/32 ,  B32B27/36 ,  C08F220/16 ,  C08K3/2279 ,  C08K5/0041 ,  C08K9/02 ,  C09D4/00 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/38 ,  G03F7/0043 ,  H05K3/185

Abstract: The present disclosure relates to LDS materials comprising a first coating layer comprising a first LDS additive, and a base substrate, wherein the coating layer contacts the base substrate. Articles formed from the LDS materials are also disclosed that include a conductive path and a metal layer deposited on the activated path. Methods for making the LDS materials and corresponding articles are also described.

公开(公告)号：US20170361584A1

公开(公告)日：2017-12-21

申请号：US15535113

申请日：2015-12-08

Applicant: SABIC Global Technologies B.V.

Inventor： Wei FENG ,  Mahari TJAHJADI ,  Tong WU ,  Yuxian AN

IPC: B32B27/08 ,  C08K3/10 ,  C08K3/32 ,  H05K3/00

CPC classification number: B32B27/08 ,  C08K3/10 ,  C08K3/32 ,  C08K2003/321 ,  H05K1/0373 ,  H05K3/00 ,  H05K3/0014 ,  H05K3/185 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/107

Abstract: This disclosure relates to materials prepared using a laser-direct structuring (LDS) method. The LDS materials of the present disclosure comprise polymeric film or polymeric sheet structures containing a LDS additive and which can undergo laser-direct structuring and chemical plating to form conductive paths on their surface. The present disclosure finds use, for example, in the automotive, electronics, RFID, communications, and medical device industries.