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    System and method to maintain vacuum, or to selectively exclude/admit electromagnetic energy
    5.
    发明授权
    System and method to maintain vacuum, or to selectively exclude/admit electromagnetic energy 有权

    公开(公告)号：US12140125B2

    公开(公告)日：2024-11-12

    申请号：US17361505

    申请日：2021-06-29

    Applicant: Raytheon Company

    Inventor： Gary A. Frazier ,  Catherine Trent

    IPC: F03H1/00 ,  B64C30/00

    Abstract: A conduit is placed between a vacuum system and the open air or other gaseous environment. A laser or other excitation source is used to ionize the air on the air-side of the conduit. An axial applied electric field is used to repel positive ions from traversing the tube and reaching the region of the vacuum. Electrons are collected in the vacuum region and disposed of using a Faraday cup. The repelled ions assist in creating a counter pressure to sweep neutral atoms out of the tube and back into the ambient air. As a result, a hollow tube can connect an evacuated volume to the open air without compromising the vacuum. This is a “windowless window.” An array of such tubes can be assembled together to increase the area of the aperture.

    Patterned Conductive Microstructures within a Heat Shrinkable Substrate
    7.
    发明申请
    Patterned Conductive Microstructures within a Heat Shrinkable Substrate 有权

    公开(公告)号：US20210014959A1

    公开(公告)日：2021-01-14

    申请号：US16934951

    申请日：2020-07-21

    Applicant: Raytheon Company

    Inventor： Kyle L. Grosse ,  Catherine Trent

    IPC: H05K1/02 ,  G03F7/00 ,  H05K3/22

    Abstract: A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

    Method of making patterned conductive microstructures within a heat shrinkable substrate
    8.
    发明授权
    Method of making patterned conductive microstructures within a heat shrinkable substrate 有权

    公开(公告)号：US10721815B2

    公开(公告)日：2020-07-21

    申请号：US16029507

    申请日：2018-07-06

    Applicant: Raytheon Company

    Inventor： Kyle L. Grosse ,  Catherine Trent

    IPC: H05K1/02 ,  G03F7/00 ,  H05K3/22

    Abstract: A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

    Tailored Conductive Interconnect Structures Having Microstructures Supported By A Shrinkable Polymer
    9.
    发明申请
    Tailored Conductive Interconnect Structures Having Microstructures Supported By A Shrinkable Polymer 审中-公开

    公开(公告)号：US20200015349A1

    公开(公告)日：2020-01-09

    申请号：US16029507

    申请日：2018-07-06

    Applicant: Raytheon Company

    Inventor： Kyle L. Grosse ,  Catherine Trent

    IPC: H05K1/02 ,  H05K3/22 ,  G03F7/00

    Abstract: A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

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