公开(公告)号：US09165791B2

公开(公告)日：2015-10-20

申请号：US14069201

申请日：2013-10-31

Applicant: QUALCOMM Incorporated

Inventor： Xiaoxia Wu ,  Yunqiang Yang ,  Chengjie Zuo ,  Durodami Joscelyn Lisk

IPC: H01L23/522 ,  H01L21/48 ,  H01L49/02 ,  H01L23/538 ,  H01L23/498

CPC classification number: H01L21/486 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/645 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L28/10 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/30107 ,  H01L2924/014 ,  H01L2924/00

Abstract: Some implementations provide an interposer that includes a substrate, a first passive device in the substrate, and a second passive device. The first passive device includes a first set of through substrate vias (TSVs) in the substrate. The second passive device is configured to wirelessly couple to the first passive device. In some implementations, the second passive device includes a second set of through substrate vias (TSVs) in the substrate. In some implementations, the second passive device is configured to inductively couple to the first passive device. In some implementations, the first passive device is a first inductor and the second passive device is a second inductor. In some implementations, the interposer further includes a first set of interconnects coupled to the first set of TSVs, and a second set of interconnects coupled to the second set of TSVs.

Abstract translation: 一些实施方案提供了一种插入器，其包括衬底，衬底中的第一无源器件和第二无源器件。 第一无源器件包括衬底中的第一组贯通衬底通孔（TSV）。 第二无源设备被配置为无线地耦合到第一无源设备。 在一些实施方案中，第二无源器件包括衬底中的第二组穿通衬底通孔（TSV）。 在一些实现中，第二无源设备被配置为感应地耦合到第一无源设备。 在一些实施方案中，第一无源器件是第一电感器，第二无源器件是第二电感器。 在一些实现中，插入器还包括耦合到第一组TSV的第一组互连以及耦合到第二组TSV的第二组互连。

公开(公告)号：US20150115405A1

公开(公告)日：2015-04-30

申请号：US14069201

申请日：2013-10-31

Applicant: QUALCOMM Incorporated

Inventor： Xiaoxia Wu ,  Yunqiang Yang ,  Chengjie Zuo ,  Durodami Joscelyn Lisk

IPC: H01L23/522 ,  H01L21/48 ,  H01L49/02

CPC classification number: H01L21/486 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/645 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L28/10 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/30107 ,  H01L2924/014 ,  H01L2924/00

Abstract: Some implementations provide an interposer that includes a substrate, a first passive device in the substrate, and a second passive device. The first passive device includes a first set of through substrate vias (TSVs) in the substrate. The second passive device is configured to wirelessly couple to the first passive device. In some implementations, the second passive device includes a second set of through substrate vias (TSVs) in the substrate. In some implementations, the second passive device is configured to inductively couple to the first passive device. In some implementations, the first passive device is a first inductor and the second passive device is a second inductor. In some implementations, the interposer further includes a first set of interconnects coupled to the first set of TSVs, and a second set of interconnects coupled to the second set of TSVs.

Abstract translation: 一些实施方案提供了一种插入器，其包括衬底，衬底中的第一无源器件和第二无源器件。 第一无源器件包括衬底中的第一组贯通衬底通孔（TSV）。 第二无源设备被配置为无线地耦合到第一无源设备。 在一些实施方案中，第二无源器件包括衬底中的第二组穿通衬底通孔（TSV）。 在一些实现中，第二无源设备被配置为感应地耦合到第一无源设备。 在一些实施方案中，第一无源器件是第一电感器，第二无源器件是第二电感器。 在一些实现中，插入器还包括耦合到第一组TSV的第一组互连以及耦合到第二组TSV的第二组互连。