公开(公告)号：US20170271919A1

公开(公告)日：2017-09-21

申请号：US15267639

申请日：2016-09-16

Applicant: QUALCOMM Incorporated

Inventor： William Henry VON NOVAK, III ,  Mei-Li CHI ,  Ravindra SHENOY ,  Rashid Ahmed Akbar ATTAR ,  Karim ARABI ,  Donald KIDWELL, JR. ,  Jon LASITER

IPC: H02J50/05 ,  H02J50/15 ,  H02J50/90 ,  H02J50/12

CPC classification number: H02J50/05 ,  A61N1/3787 ,  H02J7/025 ,  H02J50/10 ,  H02J50/12 ,  H02J50/15 ,  H02J50/50 ,  H02J50/90

Abstract: A method of providing power to an implant includes: transcutaneously receiving first power wirelessly from a source transmitter by a receiver of a power relay device, the receiver of the power relay device being disposed inside a biological body and closer to a skin of the biological body than the implant is to the skin of the biological body; converting the first power into second power that has a substantially different frequency than the first power, or is of different type of power than the first power, or both; and internally coupling the second power from a transmitter of the power relay device to the implant disposed within the biological body.

公开(公告)号：US20170214127A1

公开(公告)日：2017-07-27

申请号：US15253371

申请日：2016-08-31

Applicant: QUALCOMM Incorporated

Inventor： Adam Edward NEWHAM ,  William Henry VON NOVAK, III ,  Ravindra SHENOY ,  Rashid Ahmed Akbar ATTAR ,  Kenneth David EASTON

IPC: H01Q1/27 ,  H01Q1/40 ,  H01Q1/36 ,  H04B5/00 ,  H01Q7/00

CPC classification number: H01Q1/273 ,  A61B5/065 ,  A61B5/14503 ,  A61B5/14542 ,  A61B17/3415 ,  A61B17/3468 ,  A61B2560/0219 ,  H01Q1/36 ,  H01Q1/40 ,  H01Q7/00 ,  H04B5/0037

Abstract: A biomedical system includes: a medical implant capsule including an outer body, an electric device retained by the outer body, and a power input coupled to the electric device, the medical implant capsule having a length, along an axis, and a width transverse to the axis; and an antenna coupled to the power input and configured to: receive power wirelessly and to deliver the power to the power input; wrap around the medical implant capsule, in a transit state, transverse to the length of the medical implant capsule for a distance greater than the width of the medical implant capsule; and expand to a deployed state, at least part of the antenna being further from the axis in the deployed state than in the transit state.

公开(公告)号：US20180054682A1

公开(公告)日：2018-02-22

申请号：US15677427

申请日：2017-08-15

Applicant: QUALCOMM Incorporated

Inventor： Ravindra SHENOY ,  Rohit SAUHTA ,  Elbert MCLAREN ,  Sidney SITACHITT ,  Donald William KIDWELL, JR.

IPC: H04R25/00 ,  H04R1/10

CPC classification number: H04R25/554 ,  H04R1/1016 ,  H04R1/1025 ,  H04R25/35 ,  H04R2225/023 ,  H04R2225/025 ,  H04R2225/31 ,  H05K1/028 ,  H05K1/18 ,  H05K2201/10083

Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.

公开(公告)号：US20220116717A1

公开(公告)日：2022-04-14

申请号：US17517439

申请日：2021-11-02

Applicant: QUALCOMM Incorporated

Inventor： Ravindra SHENOY ,  Rohit SAUHTA ,  Elbert MCLAREN ,  Sidney SITACHITT ,  Donald William KIDWELL, JR.

IPC: H04R25/00 ,  H04R1/10

Abstract: A device comprising a first printed circuit board (PCB); a second printed circuit board (PCB); a first flex board coupled to the first PCB and the second PCB; a first integrated device coupled to the first PCB; a speaker configured to be coupled to the first integrated device; a microphone configured to be coupled to the first integrated device; a second integrated device coupled to the second PCB, wherein the second integrated device is configured to be coupled to the first integrated device through the second PCB, the first flex board and the first PCB; and a power source configured to provide power to the first integrated device and the second integrated device. The first PCB is located between the power source and the first integrated device. The second PCB is located between the power source and the second integrated device.

公开(公告)号：US20190247618A1

公开(公告)日：2019-08-15

申请号：US16268355

申请日：2019-02-05

Applicant: QUALCOMM Incorporated

Inventor： Stephen Jay SHELLHAMMER ,  Rashid Ahmed Akbar ATTAR ,  Adam Edward NEWHAM ,  William Henry VON NOVAK ,  Osvaldo ALCALA ,  Jorge GARCIA ,  Daniel BUTTERFIELD ,  Ravindra SHENOY

IPC: A61M25/01 ,  H02J50/23 ,  H02J50/30 ,  H01L25/065 ,  A61M25/00 ,  G08C17/02

CPC classification number: A61M25/0105 ,  A61B5/0002 ,  A61B5/6851 ,  A61B5/6852 ,  A61M25/0012 ,  A61M2025/0166 ,  A61M2025/09108 ,  A61M2205/3523 ,  A61M2205/3592 ,  A61M2205/8243 ,  G08C17/02 ,  G08C2200/00 ,  H01L25/0652 ,  H02J50/23 ,  H02J50/30 ,  H03M5/12

Abstract: A medical system is provided. The medical system includes a guidewire configured to guide a catheter to a target location within a body, the guidewire including a sensor configured to collect sensor data indicative of a location within the body, and an electrical conductor configured to conduct electrical signals representing the sensor data. The medical system further includes a wireless transmitter and a first antenna electrically coupled with the sensor via the electrical conductor and configured to: receive the electrical signals representing the sensor data; generate, from the electrical signals, first wireless signals representing the sensor data; and transmit, via the first antenna, first wireless signals.