公开(公告)号：US12017299B2

公开(公告)日：2024-06-25

申请号：US17066854

申请日：2020-10-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Michio Sakurai ,  Toru Sakai ,  Kenta Kubota ,  Takashi Urashima ,  Daichi Higashi

IPC: B23K26/21 ,  B23K26/082 ,  B23K26/70

CPC classification number: B23K26/21 ,  B23K26/082 ,  B23K26/705

Abstract: Laser welding is performed while moving irradiation positions of a laser beam and a measurement beam in forward, rightward, rearward and leftward directions, and the penetration depth of a weld portion is measured during laser welding in each of the directions. Then, a direction in which a value smaller than a reference value is measured is determined to be an optical axis deviation direction, and a correction value is added to the values measured during the laser welding when the laser welding is performed in the optical axis deviation direction.

公开(公告)号：US11999008B2

公开(公告)日：2024-06-04

申请号：US16984261

申请日：2020-08-04

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Toru Sakai ,  Michio Sakurai ,  Takashi Urashima ,  Daichi Higashi

IPC: B23K26/03 ,  B23K26/06 ,  B23K26/082 ,  B23K26/21 ,  B23K31/12 ,  G01B11/22

CPC classification number: B23K26/032 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/082 ,  B23K26/21 ,  B23K31/125 ,  G01B11/22

Abstract: A laser welding device (10) for welding a weld part (35) with laser light (L) includes: a laser emitting head (20) overlapping the laser light (L) and a measurement light (S) coaxially with each other and applying the laser light (L) and the measurement light (S) to the weld part (35), the measurement light (S) having a wavelength different from a wavelength of the laser light (L); a first parallel plane plate and a second parallel plane plate, changing an irradiation position of the measurement light (S) such that the irradiation position orbitally move around a center of rotation that moves on a predetermined welding path in a radius of rotation that is smaller than ½ of a spot diameter of the laser light (L); a measuring instrument (14) repeatedly measuring a weld penetration depth of the weld part (35) based on the measurement light (S) that is emitted from the laser emitting head (20) and is reflected on the weld part (35) while the measurement light (S) is being orbitally moved; and a determiner (17) determining the weld penetration depth of the weld part (35) using a plurality of measured values of the weld penetration depth, the plurality of measured values being measured by the measuring instrument (14) within a fixed time period while shifting a start time point of the fixed time period.

公开(公告)号：US12287472B2

公开(公告)日：2025-04-29

申请号：US17723530

申请日：2022-04-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi Urashima ,  Daichi Higashi

IPC: G02B21/14 ,  F21V8/00 ,  G02B19/00 ,  G02B21/02 ,  G02B6/08

Abstract: A phase-contrast microscope includes a light source section configured to emit light; a light guide including a plurality of optical fibers, the light guide transmitting the light emitted from the light source section through the plurality of optical fibers; and an object lens including a lens and an annular phase film, the annular phase film being on the side to which light passes through the lens, the object lens being configured to enlarge an image on a sample irradiated with the light transmitted by the light guide. The plurality of optical fibers include a plurality of emission faces arranged to form a ring, and the light guide is disposed in such a manner that the plurality of emission faces are in a conjugate position to the annular phase film.

公开(公告)号：US11648629B2

公开(公告)日：2023-05-16

申请号：US16853742

申请日：2020-04-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yohei Takechi ,  Jun Yokoyama ,  Takashi Urashima

IPC: B23K26/50 ,  B23K26/06 ,  G01B11/22

CPC classification number: B23K26/50 ,  B23K26/0643 ,  B23K26/0648 ,  G01B11/22

Abstract: A laser processing apparatus is used which includes: a laser oscillator that oscillates a processing laser beam at a processing point to be processed on a surface of a workpiece; an optical interferometer that emits a measurement beam to the processing point and generates an optical interference intensity signal based on interference generated due to an optical path difference between the measurement beam reflected at the processing point and a reference beam; a first mirror that changes traveling directions of the processing laser beam and the measurement beam; a second mirror that changes an incident angle of the measurement beam onto the first mirror; a lens that focuses the processing laser beam and the measurement beam on the processing point; a memory that stores corrected processing data; a control unit that controls the laser oscillator, the first mirror, and the second mirror based on the corrected processing data; and a measurement processing unit that derives a depth of a keyhole generated at the processing point by the processing laser beam, based on the optical interference intensity signal.