公开(公告)号：US12275846B2

公开(公告)日：2025-04-15

申请号：US18012176

申请日：2021-06-14

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Jun Yasumoto ,  Rihoko Watanabe ,  Teppei Washio ,  Hiroharu Inoue

IPC: H05K1/03 ,  C08J5/24 ,  C08J7/04 ,  C08L79/08

Abstract: A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tan δ=E″/E′) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tan δ=E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.