公开(公告)号：US11183415B2

公开(公告)日：2021-11-23

申请号：US16313370

申请日：2017-06-13

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Hiroshi Ogino ,  Tomoyuki Enomoto ,  Tetsuya Shinjo ,  Kazuhiro Sawada ,  Shunsuke Moriya

IPC: H01L21/683 ,  C09J5/06 ,  C09J183/04 ,  H01L21/304 ,  H01L21/768 ,  C09J11/06

Abstract: An adhesive can be easily peeled off after polishing the back face of a wafer, which has heat resistance and can be easily washed off. An adhesive for peelably adhering between a support and a circuit-bearing face of a wafer and thereby processing a back face of the wafer, a peeling face upon peeling becomes selectable according to heating from the support side or wafer side when the adhesive is cured. The adhesive includes a component (A) curing by hydrosilylation reaction and a component (B) containing a polydimethylsiloxane. A peeling method including forming an adhesion layer by applying the adhesive to a surface of a first substrate, bonding a surface of a second substrate to the adhesion layer, curing the adhesion layer by heating from the first substrate side to form a laminate, processing the laminate, and peeling off between the first substrate and the adhesion layer.

公开(公告)号：US11926765B2

公开(公告)日：2024-03-12

申请号：US17294730

申请日：2019-11-18

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa Okuno ,  Shunsuke Moriya ,  Hiroshi Ogino ,  Ryo Karasawa ,  Tetsuya Shinjo

IPC: C09J11/06 ,  B32B43/00 ,  C09J5/06 ,  C09J183/04 ,  H01L21/683

CPC classification number: C09J11/06 ,  B32B43/006 ,  C09J5/06 ,  C09J183/04 ,  H01L21/6836 ,  C09J2400/146 ,  C09J2483/00 ,  H01L2221/68386

Abstract: An adhesive composition for use in debonding with light irradiation, which composition can achieve debonding through irradiation with light, characterized in that the adhesive composition contains an adhesive component (S) and a light-absorbing organic compound (X); and the light-absorbing organic compound (X) contains, in the molecule thereof, one or more aromatic rings, one or more rings each containing a heteroatom forming the ring, and one or more groups selected from among a carbonyl group and a thiocarbonyl group.

公开(公告)号：US11776837B2

公开(公告)日：2023-10-03

申请号：US17297174

申请日：2019-11-26

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Shunsuke Moriya ,  Kazuhiro Sawada ,  Tetsuya Shinjo

IPC: H01L21/683 ,  C09J183/04 ,  B32B37/12 ,  C09J7/40 ,  B05D3/02

CPC classification number: H01L21/6835 ,  B32B37/12 ,  C09J7/401 ,  C09J183/04 ,  H01L21/6836 ,  B05D3/02 ,  C09J2203/326 ,  C09J183/04 ,  C08K5/0025 ,  C08L83/00 ,  C08L83/00

Abstract: An adhesive composition for forming an adhesive layer that can bond a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate in a peelable manner, the composition containing a component (A) which is cured through hydrosilylation and a peeling component (B) which contains a component containing an epoxy-modified polyorganosiloxane, wherein the component (A) contains a polysiloxane (A1) including a siloxane unit represented by SiO2 (unit Q) and the like, and a platinum group metal catalyst (A2); and the polysiloxane (A1) contains a polyorganosiloxane (a1) including a siloxane unit represented by SiO2 (unit Q′) and the like, and a polyorganosiloxane (a2) including a siloxane unit represented by SiO2 (unit Q″) and the like, and having a functional group (Si—H) content of 5.0 mol/kg or greater.

公开(公告)号：US12227678B2

公开(公告)日：2025-02-18

申请号：US17294129

申请日：2019-11-14

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Kazuhiro Sawada ,  Shunsuke Moriya ,  Tetsuya Shinjo

IPC: C09J5/04 ,  B32B7/12 ,  B32B37/12 ,  B32B43/00 ,  C09J125/06 ,  C09J169/00 ,  C09J183/04 ,  H01L21/683

Abstract: A laminate debonding method includes producing a laminate by joining a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate which allows passage of infrared laser light, by the mediation of a first adhesive layer provided on the first substrate and a second adhesive layer provided on the second substrate, wherein the first adhesive layer is obtained by curing an adhesive (A) containing a component which is cured through hydrosilylation, and the second adhesive layer is obtained by use of an adhesive (B) formed of a polymer adhesive having an aromatic ring in at least one of a main chain and a side chain and which allows passage of infrared laser light; and irradiating the laminate with infrared laser light from a second substrate side for debonding the second substrate at the interface between the first and second adhesive layers.

公开(公告)号：US11732214B2

公开(公告)日：2023-08-22

申请号：US17777772

申请日：2020-11-16

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Hiroshi Ogino ,  Tetsuya Shinjo ,  Shunsuke Moriya ,  Takahisa Okuno

IPC: C11D3/43 ,  C11D1/62 ,  C11D1/52 ,  C11D3/24

CPC classification number: C11D1/62 ,  C11D1/52 ,  C11D3/245

Abstract: A cleaning agent composition for use in removing an adhesive residue, characterized in that the composition contains a quaternary ammonium salt and a composition solvent including a first organic solvent and a second organic solvent; the first organic solvent is an amide derivative represented by formula (Z) (wherein R0 represents an ethyl group, a propyl group, or an isopropyl group; and each of RA and RB represents a C1 to C4 alkyl group); the second organic solvent is a non-amide organic solvent other than the amide derivative; and the composition has a water content less than 4.0 mass %.

公开(公告)号：US12077686B2

公开(公告)日：2024-09-03

申请号：US16615981

申请日：2018-05-23

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Kazuhiro Sawada ,  Tetsuya Shinjo ,  Hiroshi Ogino ,  Satoshi Kamibayashi ,  Shunsuke Moriya

IPC: C09J183/06 ,  H01L21/683

CPC classification number: C09J183/06 ,  H01L21/6836 ,  C09J2203/326 ,  H01L2221/68318

Abstract: A temporary adhesive has excellent spin coating properties of a circuit side of a wafer and a support, and excellent heat resistance when the circuit side of the wafer or the support is attached to an adhesion layer or a rear surface of the wafer is processed, and is capable of easily separating the circuit side of the wafer from the support after polishing the rear surface of the wafer, and simply removing an adhesive attached to the wafer or the support after the separation. The adhesive contains a component (A) to be cured by a hydrosilylation reaction, and a component (B) containing an epoxy-modified polyorganosiloxane at a ratio in % by mass of the component (A) to the component (B) of 99.995:0.005 to 30:70. The component (B) is an epoxy-modified polyorganosiloxane having an epoxy value of 0.1 to 5.

公开(公告)号：US11472168B2

公开(公告)日：2022-10-18

申请号：US16761089

申请日：2018-10-30

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Hiroshi Ogino ,  Hirokazu Nishimaki ,  Ryo Karasawa ,  Tetsuya Shinjo ,  Satoshi Kamibayashi ,  Shunsuke Moriya ,  Takahisa Okuno

IPC: B32B27/38 ,  C09J7/38 ,  B32B7/023 ,  B32B7/06 ,  B32B7/12 ,  B32B27/16 ,  C09J183/04 ,  H01L21/304 ,  H01L21/683

Abstract: A laminated body for polishing a back surface of a wafer, the laminated body including an intermediate layer that is disposed between a support and a circuit surface of the wafer and peelably adheres to the support and the circuit surface, wherein the intermediate layer includes an adhesion layer in contact with the wafer and a peeling layer in contact with the support, and the peeling layer contains a novolac resin that absorbs light with a wavelength of 190 nm to 600 nm incident through the support, resulting in modification. The light transmittance of the peeling layer at a wavelength range of 190 nm to 600 nm may be 1 to 90%. The modification caused by absorption of light may be photodecomposition of the novolac resin.

公开(公告)号：US11345837B2

公开(公告)日：2022-05-31

申请号：US16627993

申请日：2018-07-05

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Shunsuke Moriya ,  Tomoyuki Enomoto ,  Tetsuya Shinjo ,  Hiroshi Ogino ,  Kazuhiro Sawada

IPC: C09J183/04 ,  C08G77/00 ,  C09J5/06 ,  H01L21/304 ,  H01L21/683 ,  C09J4/00 ,  B29C71/02 ,  C08G77/08

Abstract: An adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the adhesive including a component (A) that is cured by a hydrosilylation reaction and a component (B) containing a phenyl group-containing polyorganosiloxane, wherein a ratio in % by mass of the component (A) to the component (B) is 95:5 to 30:70. A separation method including applying the adhesive onto a first body to form an adhesion layer, attaching a second body to the adhesion layer, heating the adhesion layer from a side of the first body to cure the adhesive to form a layered body, processing the layered body, and carrying out separation between the adhesion layer, and the first and second bodies. The processing may be polishing the rear surface of the wafer.