- 专利标题： Adhesive composition for peeling off by irradiation with light, layered product, and production method and peeling method for layered product
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申请号： US17294730申请日： 2019-11-18
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公开(公告)号： US11926765B2公开(公告)日： 2024-03-12
- 发明人: Takahisa Okuno , Shunsuke Moriya , Hiroshi Ogino , Ryo Karasawa , Tetsuya Shinjo
- 申请人： NISSAN CHEMICAL CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： NISSAN CHEMICAL CORPORATION
- 当前专利权人： NISSAN CHEMICAL CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Greenblum & Bernstein, P.L.C.
- 优先权： JP 18216788 2018.11.19 JP 19098889 2019.05.27
- 国际申请： PCT/JP2019/045082 2019.11.18
- 国际公布： WO2020/105586A 2020.05.28
- 进入国家日期： 2021-05-18
- 主分类号： C09J11/06
- IPC分类号： C09J11/06 ; B32B43/00 ; C09J5/06 ; C09J183/04 ; H01L21/683
摘要：
An adhesive composition for use in debonding with light irradiation, which composition can achieve debonding through irradiation with light, characterized in that the adhesive composition contains an adhesive component (S) and a light-absorbing organic compound (X); and the light-absorbing organic compound (X) contains, in the molecule thereof, one or more aromatic rings, one or more rings each containing a heteroatom forming the ring, and one or more groups selected from among a carbonyl group and a thiocarbonyl group.
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