Integrated micro-optical systems
    1.
    发明授权
    Integrated micro-optical systems 有权
    集成微光系统

    公开(公告)号:US08059345B2

    公开(公告)日:2011-11-15

    申请号:US11976260

    申请日:2007-10-23

    IPC分类号: G02B9/06 G02B9/00

    摘要: An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers, at least one of the two optical elements being a spherical lens. The resulting optical system presents a high numerical aperture. One of the optical elements may be a refractive element formed in a material having a high index of refraction.

    摘要翻译: 集成微光学系统包括至少两个晶片,其中至少两个光学元件设置在至少两个晶片的相应表面上,两个光学元件中的至少一个是球面透镜。 所得光学系统呈现高数值孔径。 光学元件中的一个可以是在具有高折射率的材料中形成的折射元件。

    Optical head structures including support substrates adjacent
transparent substrates and related methods
    10.
    发明授权
    Optical head structures including support substrates adjacent transparent substrates and related methods 失效
    光头结构,包括与透明基板相邻的支撑基板和相关方法

    公开(公告)号:US5886971A

    公开(公告)日:1999-03-23

    申请号:US994281

    申请日:1997-12-19

    摘要: An integrated optical head, such as, for a disk drive, preferably includes an optically transparent substrate. The substrate has a diffractive optical element formed on one face and a plurality of electrical contact pads exposed on the other face. A light source is positioned to emit light through the substrate, through the diffractive optical element, and toward data storage media. The light source includes a plurality of electrical contact pads corresponding to the plurality of electrical contact-pads exposed on the face of the substrate. An optical detector is positioned to detect light reflected from the data storage media, through the diffractive optical element, and through the substrate. The optical detector includes a plurality of exposed electrical contact pads corresponding to the plurality of electrical contact pads exposed on the face of the substrate. The substrate and the light source and optical detector are passively aligned using solder bumps between pairs of contact pads. A mechanical passive alignment arrangement is also disclosed.

    摘要翻译: 诸如用于磁盘驱动器的集成光学头优选地包括光学透明的基板。 衬底具有形成在一个面上的衍射光学元件和暴露在另一个面上的多个电接触焊盘。 光源被定位成通过基底,通过衍射光学元件和数据存储介质发光。 光源包括对应于暴露在基板的表面上的多个电接触焊盘的多个电接触焊盘。 光学检测器被定位成通过衍射光学元件和通过基底来检测从数据存储介质反射的光。 光学检测器包括对应于暴露在基板的表面上的多个电接触焊盘的多个暴露的电接触焊盘。 基板和光源和光学检测器被使用在成对的接触焊盘之间的焊料凸块被动对准。 还公开了一种机械被动对准装置。