公开(公告)号：US20230199945A1

公开(公告)日：2023-06-22

申请号：US17923424

申请日：2021-06-11

Applicant: LG ENERGY SOLUTION, LTD.

Inventor： Ga Young WOO ,  Seog Jin YOON

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/38 ,  H05K13/04

CPC classification number: H05K1/028 ,  H05K1/0266 ,  H05K3/0014 ,  H05K3/0047 ,  H05K3/0023 ,  H05K3/381 ,  H05K3/384 ,  H05K13/04 ,  H05K2203/0278 ,  H05K2203/0264 ,  H05K2201/05 ,  H05K2201/09936

Abstract: The present disclosure relates to a flexible printed circuit board (FPCB) and a method for manufacturing a flexible printed circuit board, which is capable of minimizing a process tolerance generated when an outer shape of a board is processed by forming a reference mark in the FPCB and performing an outer shape processing by using the reference mark as a reference point among a series of processes for manufacturing the board.