公开(公告)号：US20240343027A1

公开(公告)日：2024-10-17

申请号：US18683123

申请日：2021-08-13

Applicant: LG ELECTRONICS INC.

Inventor： Takashi KINO ,  Dongjoo YOU ,  Jeayoul JOUNG ,  Junseok LEE ,  Seongmoon CHO ,  Eungmin LEE

IPC: B32B27/08 ,  B32B7/03 ,  B32B7/12 ,  B32B27/20 ,  B32B27/36 ,  B32B33/00 ,  H05K1/03

CPC classification number: B32B27/08 ,  B32B7/03 ,  B32B7/12 ,  B32B27/20 ,  B32B27/36 ,  B32B33/00 ,  H05K1/0373 ,  B32B2264/0242 ,  B32B2264/302 ,  B32B2264/303 ,  B32B2264/40 ,  B32B2264/501 ,  B32B2307/204 ,  B32B2307/514 ,  B32B2307/734 ,  B32B2457/08 ,  H05K2201/0195 ,  H05K2201/0212

Abstract: The present invention is applicable in the field of substrates for high-frequency circuits, and for example, relates to a composite polyimide substrate, a composite polyimide composition, and a printed circuit board using same. The composite polyimide substrate according to the present invention may include: a substrate main body including a polyimide of which at least a portion has been substituted with a polyester group; and polytetrafluoroethylene (PTFE) particles included in the substrate main body.