公开(公告)号：US12034107B2

公开(公告)日：2024-07-09

申请号：US17619852

申请日：2019-07-09

Applicant: LG ELECTRONICS INC.

Inventor： Gunho Kim ,  Bongchu Shim ,  Youngdo Kim

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/00 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L27/156 ,  H01L33/005 ,  H01L33/38 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: Discussed is an assembly board including a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion at predetermined intervals; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; barrier ribs stacked on the dielectric layer and defining cells in which semiconductor light emitting diodes are seated at the predetermined intervals along an extending direction of the plurality of assembly electrodes so as to overlap a portion of the plurality of assembly electrodes; and a voltage applying unit connected to at least opposite ends of the plurality of assembly electrodes to apply one or more voltage signals to the plurality of assembly electrodes, wherein a voltage signal of the same polarity is applied to the plurality of assembly electrodes from the voltage applying unit connected to the opposite ends.

公开(公告)号：US10714653B2

公开(公告)日：2020-07-14

申请号：US15959974

申请日：2018-04-23

Applicant: LG ELECTRONICS INC.

Inventor： Wonseok Choi ,  Gunho Kim

IPC: H01L31/18 ,  H01L31/0735 ,  H01L31/0304 ,  H01L31/0687 ,  H01L31/068 ,  H01L31/0693 ,  H01L31/0725

Abstract: Disclosed is a method of manufacturing a compound semiconductor solar cell according to an embodiment of the invention. The method of manufacturing the compound semiconductor solar cell according to the embodiment of the invention includes forming a plurality of compound semiconductor layers of at least two elements and including a base layer and an emitter layer, the base layer including a first conductivity type dopant to have a first conductivity type and the emitter layer including a second conductivity type dopant to have a second conductivity type. The forming of the plurality of compound semiconductor layers includes at least one of a process-temperature change period and a growth-rate change period.

公开(公告)号：US12165884B2

公开(公告)日：2024-12-10

申请号：US17612881

申请日：2019-05-28

Applicant: LG ELECTRONICS INC.

Inventor： Hyunho Lee ,  Bongchu Shim ,  Gunho Kim

IPC: H01L33/00 ,  H01L21/67 ,  H01L25/075

Abstract: Discussed is a self-assembly apparatus for a plurality of semiconductor light-emitting devices, and a method for self-assembly of the plurality of semiconductor light-emitting devices, whereby the apparatus includes a chamber accommodating the plurality of semiconductor light-emitting devices and a fluid; a transferor to transfer a substrate to an assembly position; a magnet to apply a magnetic force to the plurality of semiconductor light-emitting devices; a position controller to control a position of the magnet; and a vibration generator in contact with the fluid to generate a vibration in the fluid to separate the plurality of semiconductor light-emitting devices from each other while in the fluid, wherein an electric field is produced in the substrate while the plurality of semiconductor light-emitting devices are moved according to a change of the position of the magnet.

公开(公告)号：US10861991B2

公开(公告)日：2020-12-08

申请号：US15904019

申请日：2018-02-23

Applicant: LG ELECTRONICS INC.

Inventor： Soohyun Kim ,  Gunho Kim ,  Hyun Lee ,  Wonseok Choi ,  Younho Heo

IPC: H01L31/0352 ,  H01L31/0224 ,  H01L31/0735 ,  H01L31/18

Abstract: A compound semiconductor solar cell and a method of manufacturing the same are disclosed. The compound semiconductor solar cell includes a compound semiconductor layer, a front electrode positioned on a front surface of the compound semiconductor layer, a back electrode positioned on a back surface of the compound semiconductor layer, a defect portion disposed within the compound semiconductor layer and physically and electrically connected to the back electrode, and an isolation portion surrounding the defect portion.

公开(公告)号：US12080689B2

公开(公告)日：2024-09-03

申请号：US17632058

申请日：2019-09-03

Applicant: LG ELECTRONICS INC.

Inventor： Dohee Kim ,  Gunho Kim ,  Yongil Shin ,  Bongchu Shim ,  Hyunwoo Cho

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L24/83 ,  H01L24/95 ,  H01L24/29 ,  H01L24/32 ,  H01L33/007 ,  H01L33/0093 ,  H01L2224/29021 ,  H01L2224/32237 ,  H01L2224/83801 ,  H01L2224/95101 ,  H01L2224/95133 ,  H01L2224/95136

Abstract: The present invention relates to a display device having a structure in which an assembly substrate on which self-assembly has taken place can be used as a final substrate, and a method for manufacturing same. According to an embodiment of the present invention, first-conductive-type electrodes of vertical-type semiconductor light-emitting elements can be connected to seed metal, which is used as a wiring electrode, via a solder part, and thus there is the effect of directly using, as a final substrate, an assembly substrate on which the vertical-type semiconductor light-emitting elements are self-assembled, without an additional transfer process.

公开(公告)号：US12074047B2

公开(公告)日：2024-08-27

申请号：US17618108

申请日：2020-02-11

Applicant: LG ELECTRONICS INC.

Inventor： Bongchu Shim ,  Jinsung Kim ,  Hyunho Lee ,  Gunho Kim

IPC: H01L21/68 ,  H01L21/683 ,  H01L25/075

CPC classification number: H01L21/68 ,  H01L21/6833 ,  H01L25/0753

Abstract: Discussed is an assembly board for use in a method for manufacturing a display device which allows semiconductor light emitting diodes to be seated at preset positions on the assembly board using an electric field and a magnetic field, the assembly board including a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; and barrier ribs having a plurality of grooves for guiding the semiconductor light emitting diodes to the preset positions and formed on the base portion, wherein each of the plurality of grooves is arranged to overlap only one assembly electrode of the plurality of assembly electrodes such that an electric field is formed between the plurality of grooves adjacent to each other.