公开(公告)号：US10460966B2

公开(公告)日：2019-10-29

申请号：US15277792

申请日：2016-09-27

Applicant: KLA-Tencor Corporation

Inventor： Mei Sun ,  Earl Jensen ,  Jing G. Zhou ,  Ran Liu

IPC: H05K5/06 ,  H01L21/67 ,  H01L21/687

Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.

公开(公告)号：US20180052045A1

公开(公告)日：2018-02-22

申请号：US15782692

申请日：2017-10-12

Applicant: KLA-Tencor Corporation

Inventor： Mei Sun ,  Earl Jensen ,  Kevin O'Brien

IPC: G01J1/42 ,  G01J5/08 ,  G01J5/04 ,  G01J1/02 ,  G01J1/04 ,  H01L21/67 ,  G01J1/58 ,  G01J5/10

CPC classification number: G01J1/429 ,  G01J1/0204 ,  G01J1/0271 ,  G01J1/0407 ,  G01J1/58 ,  G01J5/04 ,  G01J5/0818 ,  G01J5/10 ,  G01K11/20 ,  H01L21/67248 ,  H01L21/67253 ,  H01L22/10

Abstract: A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly.

公开(公告)号：US09719867B2

公开(公告)日：2017-08-01

申请号：US14290255

申请日：2014-05-29

Applicant: KLA-Tencor Corporation

Inventor： Stephen Sharratt ,  Farhat Quli ,  Earl Jensen ,  Mei Sun

IPC: G01K17/00 ,  G01K19/00

CPC classification number: G01K19/00 ,  G01K17/00

Abstract: A heat flux sensor equipped measurement wafer includes a substrate, a cover thermally coupled to a portion of the substrate, a sensor cavity formed between the substrate and the cover, a thermal barrier disposed within at least a portion of the sensor cavity, a bottom temperature sensor thermally coupled to the substrate and insulated from the cover by a portion of the thermal barrier and a top temperature sensor thermally coupled to the cover and insulated from the substrate by an additional portion of the thermal barrier, wherein a temperature difference between the bottom temperature sensor and the top temperature sensor is related to a heat flux passing through the substrate and cover proximate to the sensor cavity.

公开(公告)号：US20170365495A1

公开(公告)日：2017-12-21

申请号：US15277792

申请日：2016-09-27

Applicant: KLA-Tencor Corporation

Inventor： Mei Sun ,  Earl Jensen ,  Jing G. Zhou ,  Ran Liu

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67253 ,  H01L21/67248 ,  H01L21/68764

Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.

公开(公告)号：US20160138969A1

公开(公告)日：2016-05-19

申请号：US14880899

申请日：2015-10-12

Applicant: KLA-Tencor Corporation

Inventor： Mei Sun ,  Earl Jensen ,  Kevin O'Brien

IPC: G01J1/42 ,  G01J1/58 ,  G01J5/10

CPC classification number: G01J1/429 ,  G01J1/0204 ,  G01J1/0271 ,  G01J1/0407 ,  G01J1/58 ,  G01J5/04 ,  G01J5/0818 ,  G01J5/10 ,  G01K11/20 ,  H01L21/67248 ,  H01L21/67253 ,  H01L22/10

Abstract: A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly is disposed within the one or more cavities of the wafer assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly. The detector assembly is further configured to determine a temperature of one or more portions of the wafer assembly based on one or more characteristics of the one or more light sensors.

Abstract translation: 用于测量辐射强度和温度的测量晶片装置包括包括一个或多个空腔的晶片组件。 测量晶片装置还包括检测器组件。 检测器组件设置在晶片组件的一个或多个空腔内。 检测器组件包括一个或多个光传感器。 检测器组件还被配置为对入射在晶片组件的表面上的紫外线的强度进行直接或间接的测量。 检测器组件还被配置为基于一个或多个光传感器的一个或多个特性来确定晶片组件的一个或多个部分的温度。

公开(公告)号：US11823925B2

公开(公告)日：2023-11-21

申请号：US16665960

申请日：2019-10-28

Applicant: KLA-Tencor Corporation

Inventor： Mei Sun ,  Earl Jensen ,  Jing G Zhou ,  Ran Liu

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67253 ,  H01L21/67248 ,  H01L21/68764

Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.

公开(公告)号：US10777393B2

公开(公告)日：2020-09-15

申请号：US15851184

申请日：2017-12-21

Applicant: KLA-Tencor Corporation

Inventor： Earl Jensen ,  Mei Sun

IPC: H01J37/32 ,  H01L21/67 ,  G01R19/00 ,  H01L21/66

Abstract: A sensing device for measuring a plasma process parameter in a plasma chamber for processing workpieces may include a substrate with one or more sensor embedded in the substrate. The substrate can have a surface made of substantially the same material as workpieces that are plasma processed in the plasma chamber. Each sensor can include a collector portion made of substantially the same material as the substrate surface. The collector portion includes a surface that is level with the surface of the substrate. The collector portion is the top surface of the substrate. Sensor electronics are embedded into the substrate and coupled to the collector portion. When the substrate surface is exposed to a plasma one or more signals resulting from the plasma can be measured with the sensor(s).

公开(公告)号：US10215626B2

公开(公告)日：2019-02-26

申请号：US15782692

申请日：2017-10-12

Applicant: KLA-Tencor Corporation

Inventor： Mei Sun ,  Earl Jensen ,  Kevin O'Brien

IPC: G01J5/10 ,  G01J1/58 ,  G01J1/42 ,  H01L21/67 ,  G01J1/02 ,  G01J1/04 ,  G01J5/04 ,  G01J5/08 ,  G01K11/20 ,  H01L21/66

Abstract: A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly.

公开(公告)号：US09823121B2

公开(公告)日：2017-11-21

申请号：US14880899

申请日：2015-10-12

Applicant: KLA-Tencor Corporation

Inventor： Mei Sun ,  Earl Jensen ,  Kevin O'Brien

IPC: G01J5/10 ,  G01J1/42 ,  G01J1/58 ,  H01L21/67 ,  G01J1/02 ,  G01J1/04 ,  G01J5/04 ,  G01J5/08 ,  H01L21/66

CPC classification number: G01J1/429 ,  G01J1/0204 ,  G01J1/0271 ,  G01J1/0407 ,  G01J1/58 ,  G01J5/04 ,  G01J5/0818 ,  G01J5/10 ,  G01K11/20 ,  H01L21/67248 ,  H01L21/67253 ,  H01L22/10

Abstract: A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly is disposed within the one or more cavities of the wafer assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly. The detector assembly is further configured to determine a temperature of one or more portions of the wafer assembly based on one or more characteristics of the one or more light sensors.

公开(公告)号：US20170219437A1

公开(公告)日：2017-08-03

申请号：US15277753

申请日：2016-09-27

Applicant: KLA-Tencor Corporation

Inventor： Mei Sun ,  Vaibhaw Vishal

IPC: G01K1/20 ,  G01T7/00 ,  G01K7/16 ,  G01T1/16 ,  G01L9/02 ,  G01K7/02

CPC classification number: G01K1/20 ,  G01K1/026 ,  G01K7/02 ,  G01K7/16 ,  G01K13/00 ,  G01L9/025 ,  G01T1/16 ,  G01T7/00

Abstract: An apparatus includes a substrate, a nested enclosure assembly including an outer enclosure and an inner enclosure, wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses at least the electronic assembly. An insulating medium is disposed within a cavity between the outer surface of the inner enclosure and the inner surface of the outer enclosure and the system includes a sensor assembly communicatively coupled to the electronic assembly. The sensor assembly includes one or more sensors that are configured to acquire one or more measurement parameters at one or more locations of the substrate. The electronic assembly is configured to receive the one or more measurement parameters from the one or more sensors.