公开(公告)号：US11150140B2

公开(公告)日：2021-10-19

申请号：US15277753

申请日：2016-09-27

Applicant: KLA-Tencor Corporation

Inventor： Mei Sun ,  Vaibhaw Vishal

IPC: G01K1/20 ,  G01K1/02 ,  G01K13/00 ,  G01K7/02 ,  G01K7/16 ,  G01L9/02 ,  G01T1/16 ,  G01T7/00

Abstract: An apparatus includes a substrate, a nested enclosure assembly including an outer enclosure and an inner enclosure, wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses at least the electronic assembly. An insulating medium is disposed within a cavity between the outer surface of the inner enclosure and the inner surface of the outer enclosure and the system includes a sensor assembly communicatively coupled to the electronic assembly. The sensor assembly includes one or more sensors that are configured to acquire one or more measurement parameters at one or more locations of the substrate. The electronic assembly is configured to receive the one or more measurement parameters from the one or more sensors.

公开(公告)号：US10083852B1

公开(公告)日：2018-09-25

申请号：US15652659

申请日：2017-07-18

Applicant: KLA-Tencor Corporation

Inventor： Aviv Balan ,  Vaibhaw Vishal

IPC: H01L21/68 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68721 ,  H01L21/67017 ,  H01L21/6838 ,  H01L21/68728 ,  H01L21/68735 ,  H01L21/68757

Abstract: Edge grippers are disposed around an outer edge of a chuck. Each of the edge grippers includes a finger configured to pivot around a point; a contact pad configured to contact the wafer; and a flexure disposed between the contact pad and the finger. The flexure is configured to flex toward and away from the chuck. The chuck can use a matrix of vacuum and pressure nozzles designed to keep a wafer floating above the chuck. The edge grippers can hold the wafer at the edge while minimizing deformation of the wafer or without affecting z-jitter of the wafer.

公开(公告)号：US20170219437A1

公开(公告)日：2017-08-03

申请号：US15277753

申请日：2016-09-27

Applicant: KLA-Tencor Corporation

Inventor： Mei Sun ,  Vaibhaw Vishal

IPC: G01K1/20 ,  G01T7/00 ,  G01K7/16 ,  G01T1/16 ,  G01L9/02 ,  G01K7/02

CPC classification number: G01K1/20 ,  G01K1/026 ,  G01K7/02 ,  G01K7/16 ,  G01K13/00 ,  G01L9/025 ,  G01T1/16 ,  G01T7/00

Abstract: An apparatus includes a substrate, a nested enclosure assembly including an outer enclosure and an inner enclosure, wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses at least the electronic assembly. An insulating medium is disposed within a cavity between the outer surface of the inner enclosure and the inner surface of the outer enclosure and the system includes a sensor assembly communicatively coupled to the electronic assembly. The sensor assembly includes one or more sensors that are configured to acquire one or more measurement parameters at one or more locations of the substrate. The electronic assembly is configured to receive the one or more measurement parameters from the one or more sensors.