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公开(公告)号：US08786850B2
公开(公告)日：2014-07-22
申请号：US13662626
申请日：2012-10-29
Applicant: KLA-Tencor Corporation
Inventor： Christian Wolters , Aleksey Petrenko , Kurt L. Haller , Juergen Reich , Zhiwei Xu , Stephen Biellak , George Kren
CPC classification number: G01N21/8806 , F21V23/003 , G01N21/9501 , G01N2021/8835
Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.
Abstract translation: 本公开涉及一种管理照射能量的系统和方法，所述照明能量施加到被扫描的晶片的照明部分，以减轻照射诱发的损伤，而不会不必要地损害检查系统的信噪比。 可以以选定的旋转频率旋转晶片，以利用检查系统扫描晶片缺陷。 照射能量可以在晶片的至少一个扫描区域上作为照射部分离晶片中心的径向距离和晶片的选定旋转频率的函数而变化。 照明能量可以进一步在晶片的一个或多个扫描区域上恒定地超过距离晶片中心的选定距离。
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Patent Agency Ranking
公开(公告)号：US20140328043A1
公开(公告)日：2014-11-06
申请号：US14336810
申请日：2014-07-21
Applicant: KLA-Tencor Corporation
Inventor： Christian Wolters , Aleksey Petrenko , Kurt L. Haller , Juergen Reich , Zhiwei Xu , Stephen Biellak , George Kren
CPC classification number: G01N21/8806 , F21V23/003 , G01N21/9501 , G01N2021/8835
Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.
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公开(公告)号：US10551320B2
公开(公告)日：2020-02-04
申请号：US15419355
申请日：2017-01-30
Applicant: KLA-Tencor Corporation
Inventor： Kurt L. Haller
Abstract: Methods and systems for detecting a particle defect on a wafer surface, transforming the particle to a spectroscopically active state, and identifying a material composition of the activated particle by a spectroscopic technique are described herein. Particle defects are transformed by chemical treatment, thermal treatment, photochemical treatment, or a combination thereof, such that an activated particle exhibits atomic vibrational bands that can be observed spectroscopically. In one embodiment, a surface inspection system detects the presence of a particle defect on a wafer surface, activates observable Raman bands in one or more of the detected particles, and identifies the material composition of the activated particle by a spectroscopic technique. By performing both defect detection and composition analysis on the same inspection tool, it is not necessary to transfer a wafer to a different review tool, or combination of tools, to perform composition analysis of particle defects deposited on semiconductor wafers.
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公开(公告)号：US20180217065A1
公开(公告)日：2018-08-02
申请号：US15419355
申请日：2017-01-30
Applicant: KLA-Tencor Corporation
Inventor： Kurt L. Haller
Abstract: Methods and systems for detecting a particle defect on a wafer surface, transforming the particle to a spectroscopically active state, and identifying a material composition of the activated particle by a spectroscopic technique are described herein. Particle defects are transformed by chemical treatment, thermal treatment, photochemical treatment, or a combination thereof, such that an activated particle exhibits atomic vibrational bands that can be observed spectroscopically. In one embodiment, a surface inspection system detects the presence of a particle defect on a wafer surface, activates observable Raman bands in one or more of the detected particles, and identifies the material composition of the activated particle by a spectroscopic technique. By performing both defect detection and composition analysis on the same inspection tool, it is not necessary to transfer a wafer to a different review tool, or combination of tools, to perform composition analysis of particle defects deposited on semiconductor wafers.
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公开(公告)号：US09194812B2
公开(公告)日：2015-11-24
申请号：US14336810
申请日：2014-07-21
Applicant: KLA-Tencor Corporation
Inventor： Christian Wolters , Aleksey Petrenko , Kurt L. Haller , Juergen Reich , Zhiwei Xu , Stephen Biellak , George Kren
CPC classification number: G01N21/8806 , F21V23/003 , G01N21/9501 , G01N2021/8835
Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.
Abstract translation: 本公开涉及一种管理照射能量的系统和方法，所述照明能量施加到被扫描的晶片的照明部分，以减轻照射诱发的损伤，而不会不必要地损害检查系统的信噪比。 可以以选定的旋转频率旋转晶片，以利用检查系统扫描晶片缺陷。 照射能量可以在晶片的至少一个扫描区域上作为照射部分离晶片中心的径向距离和晶片的选定旋转频率的函数而变化。 照明能量可以进一步在晶片的一个或多个扫描区域上恒定地超过距离晶片中心的选定距离。
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公开(公告)号：US20140118729A1
公开(公告)日：2014-05-01
申请号：US13662626
申请日：2012-10-29
Applicant: KLA-Tencor Corporation
Inventor： Christian Wolters , Aleksey Petrenko , Kurt L. Haller , Juergen Reich , Zhiwei Xu , Stephen Biellak , George J. Kren
IPC: G01N21/95
CPC classification number: G01N21/8806 , F21V23/003 , G01N21/9501 , G01N2021/8835
Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.
Abstract translation: 本公开涉及一种管理照射能量的系统和方法，所述照明能量施加到被扫描的晶片的照明部分，以减轻照射诱发的损伤，而不会不必要地损害检查系统的信噪比。 可以以选定的旋转频率旋转晶片，以利用检查系统扫描晶片缺陷。 照射能量可以在晶片的至少一个扫描区域上作为照射部分离晶片中心的径向距离和晶片的选定旋转频率的函数而变化。 照明能量可以进一步在晶片的一个或多个扫描区域上恒定地超过距离晶片中心的选定距离。
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