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公开(公告)号：US20140185919A1
公开(公告)日：2014-07-03
申请号：US13733133
申请日：2013-01-02
Applicant: KLA-Tencor Corporation
Inventor： Jun Lang , Kan Chen , Lisheng Gao , Junqing Huang
IPC: G06T7/00
CPC classification number: G06T7/0004 , G01N21/8851 , G01N21/9501 , G01N2021/8867 , G03F7/70616 , G03F7/7065 , G06T7/0008 , G06T2207/10152 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes identifying one or more characteristics of first raw output generated for a wafer that correspond to one or more geometrical characteristics of patterned features formed on the wafer and assigning individual output in second raw output generated for the wafer to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the second raw output and individual output in the first raw output that were generated at substantially the same locations on the wafer such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments in the second raw output are different.
Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括识别对应于晶片上形成的图案化特征的一个或多个几何特征的晶片产生的第一原始输出的一个或多个特征，并且基于所识别的将针对晶片生成的第二原始输出中的各个输出分配给不同的段 第一原始输出的一个或多个特征，并且基于第二原始输出中的单独输出和在第一原始输出中在晶片上的基本相同位置处产生的单独输出，使得图案化的一个或多个几何特征 对应于第二原始输出中的每个不同段的特征是不同的。
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公开(公告)号：US09053527B2
公开(公告)日：2015-06-09
申请号：US13733133
申请日：2013-01-02
Applicant: KLA-Tencor Corporation
Inventor： Jun Lang , Kan Chen , Lisheng Gao , Junqing Huang
CPC classification number: G06T7/0004 , G01N21/8851 , G01N21/9501 , G01N2021/8867 , G03F7/70616 , G03F7/7065 , G06T7/0008 , G06T2207/10152 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes identifying one or more characteristics of first raw output generated for a wafer that correspond to one or more geometrical characteristics of patterned features formed on the wafer and assigning individual output in second raw output generated for the wafer to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the second raw output and individual output in the first raw output that were generated at substantially the same locations on the wafer such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments in the second raw output are different.
Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括识别对应于晶片上形成的图案化特征的一个或多个几何特征的晶片产生的第一原始输出的一个或多个特征，并且基于所识别的将针对晶片生成的第二原始输出中的各个输出分配给不同的段 第一原始输出的一个或多个特征，并且基于第二原始输出中的单独输出和在第一原始输出中在晶片上的基本相同位置处产生的单独输出，使得图案化的一个或多个几何特征 对应于第二原始输出中的每个不同段的特征是不同的。
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