公开(公告)号：US10571248B2

公开(公告)日：2020-02-25

申请号：US15649259

申请日：2017-07-13

Applicant: KLA-Tencor Corporation

Inventor： Helen Liu ,  Andrew Zeng

IPC: G01B11/06 ,  G01B11/24 ,  G01N21/84 ,  G01N21/956 ,  G01N21/95

Abstract: A system includes one or more wafer geometry measurement tools configured to obtain geometry measurements from a wafer. The system also includes one or more processors in communication with the one or more wafer geometry measurement tools. The one or more processors are configured to apply a correction model to correct the geometry measurements obtained by the one or more wafer geometry measurement tools. The correction model is configured to correct measurement errors caused by a transparent film positioned on the wafer.

公开(公告)号：US09897433B2

公开(公告)日：2018-02-20

申请号：US14980215

申请日：2015-12-28

Applicant: KLA-Tencor Corporation

Inventor： Helen Liu ,  Xuan Zhao ,  Xiaowei Li

IPC: G01B9/02 ,  G01B11/06 ,  G01B11/24

CPC classification number: G01B9/02083 ,  G01B9/02078 ,  G01B9/02088 ,  G01B11/0608 ,  G01B11/2441 ,  G01B2210/56

Abstract: A wafer metrology system includes an interferometer sub-system and a controller. The interferometer sub-system is configured to generate an interferogram with an intensity map that corresponds to a modulated representation of a wafer surface. Further, the interferometer sub-system includes a detector configured to capture the interferogram. The controller includes one or more processors configured to generate a wrapped phase map of the interferogram, define patterns associated with features on the wafer, and correct phase discontinuities by applying a phase unwrapping procedure to the wrapped phase map to generate an unwrapped phase map and correcting phase discontinuities in the unwrapped phase map based on the patterns, or by combining phase unwrapping and correction in a unified step. Further, the patterns comprise two or more structures such that a portion of the unwrapped phase map associated with structures of the same type is continuous across borders separating structures of the same type.

公开(公告)号：US20180195855A1

公开(公告)日：2018-07-12

申请号：US15649259

申请日：2017-07-13

Applicant: KLA-Tencor Corporation

Inventor： Helen Liu ,  Andrew Zeng

IPC: G01B11/06 ,  G01B11/24 ,  G01N21/95 ,  G01N21/956 ,  G01N21/84

Abstract: A system includes one or more wafer geometry measurement tools configured to obtain geometry measurements from a wafer. The system also includes one or more processors in communication with the one or more wafer geometry measurement tools. The one or more processors are configured to apply a correction model to correct the geometry measurements obtained by the one or more wafer geometry measurement tools. The correction model is configured to correct measurement errors caused by a transparent film positioned on the wafer.

公开(公告)号：US20170241764A1

公开(公告)日：2017-08-24

申请号：US14980215

申请日：2015-12-28

Applicant: KLA-Tencor Corporation

Inventor： Helen Liu ,  Xuan Zhao ,  Xiaowei Li

IPC: G01B9/02 ,  G01B11/06

CPC classification number: G01B9/02083 ,  G01B9/02078 ,  G01B9/02088 ,  G01B11/0608 ,  G01B11/2441 ,  G01B2210/56

Abstract: A wafer metrology system includes an interferometer sub-system and a controller. The interferometer sub-system is configured to generate an interferogram with an intensity map that corresponds to a modulated representation of a wafer surface. Further, the interferometer sub-system includes a detector configured to capture the interferogram. The controller includes one or more processors configured to generate a wrapped phase map of the interferogram, define patterns associated with features on the wafer, and correct phase discontinuities by applying a phase unwrapping procedure to the wrapped phase map to generate an unwrapped phase map and correcting phase discontinuities in the unwrapped phase map based on the patterns, or by combining phase unwrapping and correction in a unified step. Further, the patterns comprise two or more structures such that a portion of the unwrapped phase map associated with structures of the same type is continuous across borders separating structures of the same type.

公开(公告)号：US10217190B2

公开(公告)日：2019-02-26

申请号：US15391520

申请日：2016-12-27

Applicant: KLA-Tencor Corporation

Inventor： Helen Liu ,  Rohit Patnaik ,  Stephen Osborne

IPC: G06K9/32 ,  G06T3/40 ,  G06T5/20 ,  G06T5/50

Abstract: A method for reconstructing one or more high-resolution point spread functions (PSF) from one or more low-resolution images includes acquiring one or more low-resolution images of a wafer, aggregating the one or more low-resolution image patches, and estimating one or more sub-pixel shifts in the one or more low-resolution images and simultaneously reconstructing one or more high-resolution PSF from the aggregated one or more low-resolution image patches.

公开(公告)号：US20180182067A1

公开(公告)日：2018-06-28

申请号：US15391520

申请日：2016-12-27

Applicant: KLA-Tencor Corporation

Inventor： Helen Liu ,  Rohit Patnaik ,  Stephen Osborne

IPC: G06T3/40 ,  G06T5/20 ,  G06T5/50

CPC classification number: G06T3/4053 ,  G06T3/4069 ,  G06T5/002 ,  G06T5/20 ,  G06T5/50

Abstract: A method for reconstructing one or more high-resolution point spread functions (PSF) from one or more low-resolution images includes acquiring one or more low-resolution images of a wafer, aggregating the one or more low-resolution image patches, and estimating one or more sub-pixel shifts in the one or more low-resolution images and simultaneously reconstructing one or more high-resolution PSF from the aggregated one or more low-resolution image patches.