-
Patent Agency Ranking
公开(公告)号：US09194812B2
公开(公告)日：2015-11-24
申请号：US14336810
申请日：2014-07-21
Applicant: KLA-Tencor Corporation
Inventor： Christian Wolters , Aleksey Petrenko , Kurt L. Haller , Juergen Reich , Zhiwei Xu , Stephen Biellak , George Kren
CPC classification number: G01N21/8806 , F21V23/003 , G01N21/9501 , G01N2021/8835
Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.
Abstract translation: 本公开涉及一种管理照射能量的系统和方法，所述照明能量施加到被扫描的晶片的照明部分，以减轻照射诱发的损伤，而不会不必要地损害检查系统的信噪比。 可以以选定的旋转频率旋转晶片，以利用检查系统扫描晶片缺陷。 照射能量可以在晶片的至少一个扫描区域上作为照射部分离晶片中心的径向距离和晶片的选定旋转频率的函数而变化。 照明能量可以进一步在晶片的一个或多个扫描区域上恒定地超过距离晶片中心的选定距离。
-
2.发明授权Bright-field differential interference contrast system with scanning beams of round and elliptical cross-sections 有权具有圆形和椭圆形横截面的扫描光束的明场差分干涉对比度系统公开(公告)号：US09052190B2
公开(公告)日：2015-06-09
申请号：US13797901
申请日：2013-03-12
Applicant: KLA-Tencor Corporation
Inventor： Ali Salehpour , Jaydeep Sinha , Kurt Lindsay Haller , Pradeep Vukkadala , George Kren , Jiayao Zhang , Mehdi Vaez-Iravani
CPC classification number: G01B11/303 , G01B11/306 , G01B2210/56
Abstract: A method of providing high accuracy inspection or metrology in a bright-field differential interference contrast (BF-DIC) system is described. This method can include creating first and second beams from a first light beam. The first and second beams have round cross-sections, and form first partially overlapping scanning spots radially displaced on a substrate. Third and fourth beams are created from the first light beam or a second light beam. The third and fourth beams have elliptical cross-sections, and form second partially overlapping scanning spots tangentially displaced on the substrate. At least one portion of the substrate can be scanned using the first and second partially overlapping scanning spots as the substrate is rotated. Radial and tangential slopes can be determined using measurements obtained from the scanning using the first and second partially overlapping scanning spots. These slopes can be used to determine wafer shape or any localized topography feature.
Abstract translation: 描述了在亮场差分干涉对比（BF-DIC）系统中提供高精度检测或计量的方法。 该方法可以包括从第一光束产生第一和第二光束。 第一和第二光束具有圆形横截面，并形成在衬底上径向位移的第一部分重叠的扫描点。 从第一光束或第二光束产生第三和第四光束。 第三和第四光束具有椭圆形横截面，并形成在衬底上切向位移的第二部分重叠的扫描点。 当衬底旋转时，可以使用第一和第二部分重叠的扫描点来扫描衬底的至少一部分。 可以使用从使用第一和第二部分重叠的扫描点的扫描获得的测量来确定径向和切向斜率。 这些斜面可用于确定晶片形状或任何局部地形特征。
-
公开(公告)号：US08786850B2
公开(公告)日：2014-07-22
申请号：US13662626
申请日：2012-10-29
Applicant: KLA-Tencor Corporation
Inventor： Christian Wolters , Aleksey Petrenko , Kurt L. Haller , Juergen Reich , Zhiwei Xu , Stephen Biellak , George Kren
CPC classification number: G01N21/8806 , F21V23/003 , G01N21/9501 , G01N2021/8835
Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.
Abstract translation: 本公开涉及一种管理照射能量的系统和方法，所述照明能量施加到被扫描的晶片的照明部分，以减轻照射诱发的损伤，而不会不必要地损害检查系统的信噪比。 可以以选定的旋转频率旋转晶片，以利用检查系统扫描晶片缺陷。 照射能量可以在晶片的至少一个扫描区域上作为照射部分离晶片中心的径向距离和晶片的选定旋转频率的函数而变化。 照明能量可以进一步在晶片的一个或多个扫描区域上恒定地超过距离晶片中心的选定距离。
-
公开(公告)号：US20140328043A1
公开(公告)日：2014-11-06
申请号：US14336810
申请日：2014-07-21
Applicant: KLA-Tencor Corporation
Inventor： Christian Wolters , Aleksey Petrenko , Kurt L. Haller , Juergen Reich , Zhiwei Xu , Stephen Biellak , George Kren
CPC classification number: G01N21/8806 , F21V23/003 , G01N21/9501 , G01N2021/8835
Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.
-
5.发明申请Enhanced Inspection and Metrology Techniques And Systems Using Bright-Field Differential Interference Contrast 有权增强的检测和计量技术和使用明场差分干涉对比的系统公开(公告)号：US20140268172A1
公开(公告)日：2014-09-18
申请号：US13797901
申请日：2013-03-12
Applicant: KLA-Tencor Corporation
Inventor： Ali Salehpour , Jaydeep Sinha , Kurt Lindsay Haller , Pradeep Vukkadala , George Kren , Jiayao Zhang , Mehdi Vaez-Iravani
IPC: G01B11/24
CPC classification number: G01B11/303 , G01B11/306 , G01B2210/56
Abstract: A method of providing high accuracy inspection or metrology in a bright-field differential interference contrast (BF-DIC) system is described. This method can include creating first and second beams from a first light beam. The first and second beams have round cross-sections, and form first partially overlapping scanning spots radially displaced on a substrate. Third and fourth beams are created from the first light beam or a second light beam. The third and fourth beams have elliptical cross-sections, and form second partially overlapping scanning spots tangentially displaced on the substrate. At least one portion of the substrate can be scanned using the first and second partially overlapping scanning spots as the substrate is rotated. Radial and tangential slopes can be determined using measurements obtained from the scanning using the first and second partially overlapping scanning spots. These slopes can be used to determine wafer shape or any localized topography feature.
Abstract translation: 描述了在亮场差分干涉对比（BF-DIC）系统中提供高精度检测或计量的方法。 该方法可以包括从第一光束产生第一和第二光束。 第一和第二光束具有圆形横截面，并形成在衬底上径向位移的第一部分重叠的扫描点。 从第一光束或第二光束产生第三和第四光束。 第三和第四光束具有椭圆形横截面，并形成在衬底上切向位移的第二部分重叠的扫描点。 当衬底旋转时，可以使用第一和第二部分重叠的扫描点来扫描衬底的至少一部分。 可以使用从使用第一和第二部分重叠的扫描点的扫描获得的测量来确定径向和切向斜率。 这些斜面可用于确定晶片形状或任何局部地形特征。
-
-
-
-
Search Results
5
records
(took 0.013 seconds)
