公开(公告)号：US09587936B2

公开(公告)日：2017-03-07

申请号：US13826790

申请日：2013-03-14

Applicant: KLA-Tencor Corporation

Inventor： Yury Yuditsky ,  Alexander Slobodov ,  Anatoly Romanovsky

IPC: G01B21/04 ,  G01N21/95 ,  G03F1/84

CPC classification number: G01B21/045 ,  G01N21/9501 ,  G03F1/84

Abstract: A wafer is moved under an inspection spot by a rotary inspection system. The system rotates the wafer about an axis of rotation and translates the wafer along a linear trajectory. When the inspection spot is not aligned with the trajectory of the axis of rotation, an angular error is introduced in the representation of the position of the inspection spot with respect to the wafer by the rotary encoder. The angular error is corrected based on an angular error correction value. The angular error correction value is determined based on the distance between the inspection spot and the trajectory of the axis of rotation, the radial distance between the axis of rotation and the inspection spot at a first instance of a particular angular position, and a second radial distance between the axis of rotation and the inspection location at a second instance of the angular position.

Abstract translation: 通过旋转检查系统将晶片在检查点下移动。 系统围绕旋转轴旋转晶片，并沿着线性轨迹平移晶片。 当检查点不与旋转轴线的轨迹对准时，通过旋转编码器在检查点相对于晶片的位置的表示中引入角度误差。 基于角度误差校正值校正角度误差。 角度误差校正值基于检查点与旋转轴线的轨迹之间的距离，旋转轴线与特定角度位置的第一阶段的检查点之间的径向距离和第二径向 在角位置的第二个实例处，旋转轴线与检查位置之间的距离。

公开(公告)号：US09810619B2

公开(公告)日：2017-11-07

申请号：US14022305

申请日：2013-09-10

Applicant: KLA-Tencor Corporation

Inventor： Zhongping Cai ,  Jingyi Xiong ,  Tyler Trytko ,  Alexander Slobodov ,  Paul Doyle ,  Anatoly Romanovsky

IPC: G01N21/01 ,  G01N21/956 ,  G01B5/00

CPC classification number: G01N21/01 ,  G01B5/0004 ,  G01N21/956

Abstract: A system for substrate tilt and focus control in an inspection system includes a dynamically actuatable substrate stage assembly including a substrate stage for securing a substrate; a tilt-height detection system including: a height detection sub-system and a tilt detection sub-system. The system further includes a first actuator configured to selectably actuate the substrate along a direction perpendicular to the surface of the substrate at a location of the substrate stage assembly; and an additional actuator configured to selectably actuate the substrate along a direction substantially perpendicular to the surface of the substrate at an additional location of the substrate stage assembly; and a MIMO tilt-focus controller communicatively coupled to the height detection sub-system, the tilt detection sub-system, the first actuator and the additional actuator.

公开(公告)号：US20140278188A1

公开(公告)日：2014-09-18

申请号：US13826790

申请日：2013-03-14

Applicant: KLA-TENCOR CORPORATION

Inventor： Yury Yuditsky ,  Alexander Slobodov ,  Anatoly Romanovsky

IPC: G01N21/93 ,  G01B21/22

CPC classification number: G01B21/045 ,  G01N21/9501 ,  G03F1/84

Abstract: A wafer is moved under an inspection spot by a rotary inspection system. The system rotates the wafer about an axis of rotation and translates the wafer along a linear trajectory. When the inspection spot is not aligned with the trajectory of the axis of rotation, an angular error is introduced in the representation of the position of the inspection spot with respect to the wafer by the rotary encoder. The angular error is corrected based on an angular error correction value. The angular error correction value is determined based on the distance between the inspection spot and the trajectory of the axis of rotation, the radial distance between the axis of rotation and the inspection spot at a first instance of a particular angular position, and a second radial distance between the axis of rotation and the inspection location at a second instance of the angular position.

Abstract translation: 通过旋转检查系统将晶片在检查点下移动。 系统围绕旋转轴旋转晶片，并沿着线性轨迹平移晶片。 当检查点不与旋转轴线的轨迹对准时，通过旋转编码器在检查点相对于晶片的位置的表示中引入角度误差。 基于角度误差校正值校正角度误差。 角度误差校正值基于检查点与旋转轴线的轨迹之间的距离，旋转轴线与特定角度位置的第一阶段的检查点之间的径向距离和第二径向 在角位置的第二个实例处，旋转轴线与检查位置之间的距离。

公开(公告)号：US20140071457A1

公开(公告)日：2014-03-13

申请号：US14022305

申请日：2013-09-10

Applicant: Kla-Tencor Corporation

Inventor： Zhongping Cai ,  Jingyi Xiong ,  Tyler Trytko ,  Alexander Slobodov ,  Paul Doyle ,  Anatoly Romanovsky

IPC: G01N21/01

CPC classification number: G01N21/01 ,  G01B5/0004 ,  G01N21/956

Abstract: A system for substrate tilt and focus control in an inspection system includes a dynamically actuatable substrate stage assembly including a substrate stage for securing a substrate; a tilt-height detection system including: a height detection sub-system and a tilt detection sub-system. The system further includes a first actuator configured to selectably actuate the substrate along a direction perpendicular to the surface of the substrate at a location of the substrate stage assembly; and an additional actuator configured to selectably actuate the substrate along a direction substantially perpendicular to the surface of the substrate at an additional location of the substrate stage assembly; and a MIMO tilt-focus controller communicatively coupled to the height detection sub-system, the tilt detection sub-system, the first actuator and the additional actuator.

Abstract translation: 用于检查系统中的基板倾斜和聚焦控制的系统包括可动态致动的基板台组件，其包括用于固定基板的基板台; 倾斜高度检测系统，包括：高度检测子系统和倾斜检测子系统。 该系统还包括第一致动器，其被配置为在衬底台组件的位置处沿着垂直于衬底的表面的方向可选择地致动衬底; 以及附加致动器，其构造成在衬底台组件的附加位置处沿着基本上垂直于衬底表面的方向可选择地致动衬底; 以及通信地耦合到高度检测子系统，倾斜检测子系统，第一致动器和附加致动器的MIMO倾斜对焦控制器。