公开(公告)号：US20240176206A1

公开(公告)日：2024-05-30

申请号：US18116187

申请日：2023-03-01

Applicant: KLA Corporation

Inventor： Qiang Zhao ,  Ming Di ,  Xi Chen ,  Shova Subedi ,  Tianhao Zhang

IPC: G02F1/35 ,  G01N21/63 ,  G01N21/95

CPC classification number: G02F1/3532 ,  G01N21/636 ,  G01N21/9501 ,  G01N2021/0125

Abstract: A metrology system may include an illumination source to generate an illumination beam and an illumination sub-system to direct the illumination beam to a sample with an inversion-symmetric substrate and one or more films disposed on the inversion-symmetric substrate. The system may further include a filter configured to block a wavelength of the illumination beam and pass a wavelength associated with a second harmonic of the illumination beam and a detector to capture second harmonic generation (SHG) light. The system may further include a controller to receive metrology data from the detector associated with the SHG light from with an interface between the inversion-symmetric substrate and the one or more films and generate one or more metrology measurements associated with the one or more films based on the metrology data.

公开(公告)号：US20240418633A1

公开(公告)日：2024-12-19

申请号：US18232337

申请日：2023-08-09

Applicant: KLA Corporation

Inventor： Shova Subedi ,  Shankar Krishnan ,  Qiang Zhao ,  Ming Di ,  Carlos L. Ygartua ,  Mikhail Sushchik

IPC: G01N21/21 ,  G01B11/06 ,  G01N21/65 ,  G01N21/84 ,  G01N21/95 ,  G01N23/22

Abstract: A thickness of a film stack of a workpiece and a composition of the film stack is determined with an x-ray technique, spectroscopic ellipsometry (SE) and/or spectroscopic reflectometry (SR), and multiwavelength Raman spectroscopy. The measurements are combined to form combined measured data. The combining includes regressing the second measurements and the third measurements. The thickness of the film stack and the composition of the film stack is then determined using the combined measured data.

公开(公告)号：US20250146893A1

公开(公告)日：2025-05-08

申请号：US18936993

申请日：2024-11-04

Applicant: KLA CORPORATION

Inventor： Houssam Chouaib ,  Zhengquan Tan ,  Shova Subedi ,  Shankar Krishnan ,  David Y. Wang ,  Oleg Shulepov ,  Kevin Peterlinz ,  Natalia Malkova ,  Dawei Hu ,  Carlos Ygartua ,  Isvar Cordova ,  Eric Cheek ,  Roman Sappey ,  Anderson Chou

IPC: G01L1/24 ,  G01B11/06 ,  G01B11/24

Abstract: A workpiece is measured using multiple-pass spectroscopic ellipsometry and multi-wavelength Raman spectroscopy, which may be performed in the same system. These measurements are combined to form combined measured data. A stress measurement of the workpiece is determined using the combined measured data. The stress measurement can be determined using a model or a machine learning algorithm.