公开(公告)号：US11602859B2

公开(公告)日：2023-03-14

申请号：US17374846

申请日：2021-07-13

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: H01L21/687 ,  B25J15/00 ,  B25J11/00 ,  B25J19/02

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US11027437B2

公开(公告)日：2021-06-08

申请号：US16726396

申请日：2019-12-24

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J15/06 ,  H01L21/683 ,  H01L21/687

Abstract: An apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.

公开(公告)号：US20250001747A1

公开(公告)日：2025-01-02

申请号：US18779139

申请日：2024-07-22

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Michael McKenney ,  George Kovatchev

IPC: B32B37/00 ,  B32B37/10 ,  B32B41/00

Abstract: A lamination apparatus, system, and method. The apparatus, system and method are for a lamination press for laminating at least one laminating film to a subject, which may include: an upper press comprising a gel plate, an upper vacuum chamber, and tooling suitable to apply the laminating film; a lower press suitable to maintain the subject to receive the laminating film, and comprising a lower vacuum chamber, an air bearing stage, and servo-positioned tooling; and an aligner that applies the servo-positioned tooling to maintain positional balance and alignment of the subject by the air bearing stage during the laminating while enabling vertical flexure of the lower press, wherein the positional balance and alignment is substantially continuously monitored by a controller.

公开(公告)号：US12042930B2

公开(公告)日：2024-07-23

申请号：US18117716

申请日：2023-03-06

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: H01L21/687 ,  B25J11/00 ,  B25J15/00 ,  B25J19/02

CPC classification number: B25J15/0014 ,  B25J11/0095 ,  H01L21/68707 ,  B25J19/025 ,  Y10S414/141

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US11059187B2

公开(公告)日：2021-07-13

申请号：US16697271

申请日：2019-11-27

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Daniel Bateman ,  Michael Callahan

IPC: B25J15/06 ,  H01L21/683

Abstract: An apparatus, system and method for providing a vacuum ejector for use with an end effector. Included may be at least an end effector and a vacuum chamber for gripping an element during semiconductor processing. The end effector may include at least two clamp arms for placing a gripped element in relation to application of a vacuum to the gripped element; a vacuum cup having a mouth capable of sealing to the gripped element to provide a vacuum chamber; a vacuum ejector pin extending into the vacuum chamber and including a plurality of ports substantially at a tip thereof proximate to the gripped element, wherein the vacuum is applied by the plurality of ports; and an ejector pin actuator that is capable of moving the vacuum ejector pin toward the gripped element until the sealing of the mouth is broken and the gripped element is ejected from the vacuum cup.

公开(公告)号：US10518422B2

公开(公告)日：2019-12-31

申请号：US15964365

申请日：2018-04-27

Applicant: Jabil Inc.

Inventor： Jeroen Bosboom ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J15/06 ,  H01L21/683 ,  H01L21/687

Abstract: An apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include at least a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.

公开(公告)号：US20230321963A1

公开(公告)日：2023-10-12

申请号：US18208810

申请日：2023-06-12

Applicant: Jabil Inc.

Inventor： Jeroen Bosboom ,  Michael McKenney ,  George Kovatchev ,  Jeroen Bosboom ,  Michael McKenney ,  George Kovatchev

IPC: B32B37/00 ,  B32B37/10 ,  B32B41/00

CPC classification number: B32B37/0046 ,  B32B37/1018 ,  B32B41/00

Abstract: A lamination apparatus, system, and method. The apparatus, system and method are for a lamination press for laminating at least one laminating film to a subject, which may include: an upper press comprising a gel plate, an upper vacuum chamber, and tooling suitable to apply the laminating film; a lower press suitable to maintain the subject to receive the laminating film, and comprising a lower vacuum chamber, an air bearing stage, and servo-positioned tooling; and an aligner that applies the servo-positioned tooling to maintain positional balance and alignment of the subject by the air bearing stage during the laminating while enabling vertical flexure of the lower press, wherein the positional balance and alignment is substantially continuously monitored by a controller.

公开(公告)号：US20230278235A1

公开(公告)日：2023-09-07

申请号：US18117716

申请日：2023-03-06

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J11/00 ,  H01L21/687

CPC classification number: B25J15/0014 ,  B25J11/0095 ,  H01L21/68707 ,  B25J19/025

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US11059183B2

公开(公告)日：2021-07-13

申请号：US16806373

申请日：2020-03-02

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: H01L21/687 ,  B25J15/00 ,  B25J11/00 ,  B25J19/02

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US20200306990A1

公开(公告)日：2020-10-01

申请号：US16806373

申请日：2020-03-02

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J11/00 ,  H01L21/687

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.