公开(公告)号：US09832860B2

公开(公告)日：2017-11-28

申请号：US14498958

申请日：2014-09-26

Applicant: Intel Corporation

Inventor： Robert Starkston ,  John Guzek ,  Patrick Nardi ,  Keith Jones ,  Javier Soto Gonzalez

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/16 ,  H01L23/498 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K1/0271 ,  H01L23/16 ,  H01L23/49833 ,  H01L23/562 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/284 ,  H05K2201/09136 ,  H05K2201/10977 ,  H05K2201/2009

Abstract: Techniques are disclosed for forming a package substrate with integrated stiffener. A panel of package substrates are provided. An adhesion layer is then formed on each package substrate of the panel of package substrates. A panel of stiffeners are then attached to the panel of package substrates by the adhesion layer, each stiffener corresponding to a respective package substrate. The panel of package substrates is then singulated into individual package substrates with integrated stiffeners. The stiffeners on the singulated package substrates include tabs that extend to the edges of the package substrates.