公开(公告)号：US10091915B2

公开(公告)日：2018-10-02

申请号：US15790992

申请日：2017-10-23

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xuequan Yu ,  Lin Yang ,  Yadong Bai

IPC: H05K7/10 ,  H05K7/12 ,  H05K9/00 ,  H05K1/18 ,  H05K1/02 ,  H01L23/552 ,  H01L23/10

Abstract: An electronic component package structure includes at least a substrate having a set attachment area for attaching an electronic component; a conductive lid having a top and a sidewall that extends toward the substrate, where one side of the sidewall close to the substrate has a bonding end, where the bonding end bonds the conductive lid to the substrate by using a non-conductive adhesive, and the conductive lid bonded to the substrate encloses the attachment area and forms a shielding space over the attachment area; and the non-conductive adhesive is located between the substrate and the bonding end.

公开(公告)号：US20180049351A1

公开(公告)日：2018-02-15

申请号：US15790992

申请日：2017-10-23

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xuequan Yu ,  Lin Yang ,  Yadong Bai

IPC: H05K9/00 ,  H05K1/18 ,  H01L23/552 ,  H01L23/10 ,  H05K1/02

CPC classification number: H05K9/0028 ,  H01L23/10 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16151 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/164 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/0236 ,  H05K1/181

Abstract: An electronic component package structure and an electronic device where the electronic component package structure includes at least a substrate having a set attachment area for attaching an electronic component; a conductive lid having a top and a sidewall that extends toward the substrate, where one side of the sidewall close to the substrate has a bonding end, where the bonding end bonds the conductive lid to the substrate by using a non-conductive adhesive, and the conductive lid bonded to the substrate encloses the attachment area and forms a shielding space over the attachment area; and the non-conductive adhesive is located between the substrate and the bonding end, and has a dielectric constant not less than 7 and a coating thickness not greater than 0.07 millimeters (mm). With the present disclosure, an Electromagnetic Interference (EMI) shielding effect of the shielding space can be improved.

公开(公告)号：US09839167B2

公开(公告)日：2017-12-05

申请号：US14687511

申请日：2015-04-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xuequan Yu ,  Lin Yang ,  Yadong Bai

IPC: H05K7/10 ,  H05K7/12 ,  H05K9/00 ,  H01L23/10 ,  H01L23/552 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K9/0028 ,  H01L23/10 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16151 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/164 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/0236 ,  H05K1/181

Abstract: An electronic component package structure and an electronic device are provided. The electronic component package structure includes at least: a substrate having a set attachment area for attaching an electronic component; a conductive lid having a top and a sidewall that extends toward the substrate, where one side of the sidewall close to the substrate has a bonding end, where the bonding end bonds the conductive lid to the substrate by using a non-conductive adhesive, and the conductive lid bonded to the substrate encloses the attachment area and forms a shielding space over the attachment area; and the non-conductive adhesive is located between the substrate and the bonding end, and has a dielectric constant not less than 7 and a coating thickness not greater than 0.07 millimeters (mm). With the present invention, an Electromagnetic Interference (EMI) shielding effect of the shielding space can be improved.

公开(公告)号：US20150102473A1

公开(公告)日：2015-04-16

申请号：US14570822

申请日：2014-12-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xuequan Yu ,  Yadong Bai ,  Ping Yu

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/055 ,  H01L23/48

CPC classification number: H01L23/552 ,  H01L23/055 ,  H01L23/481 ,  H01L23/49805 ,  H01L23/66 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/16245 ,  H01L2224/1713 ,  H01L2224/17179 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00

Abstract: A chip package and a packaging method are provided, which relates to the field of communications technologies, and is invented to implement high-frequency electromagnetic interference shielding and effectively improve chip performance. The package includes a package substrate and a metal cap covering the package substrate, where a silicon chip placement area is arranged on an upper surface of the package substrate, multiple first conductive parts are arranged in a peripheral area of the silicon chip placement area, and an edge of the metal cap is in contact with the package substrate and electrically connected to the multiple first conductive parts, where at least a portion of first conductive parts in the multiple first conductive parts are electrically connected to a grounding part by using the metal cap, and the grounding part is arranged on the package substrate, and configured to ground the package substrate.

Abstract translation: 提供了与通信技术领域相关的芯片封装和封装方法，并且被发明以实现高频电磁干扰屏蔽并有效地提高芯片性能。 所述封装包括封装基板和覆盖所述封装基板的金属盖，在所述封装基板的上表面上配置有硅芯片放置区域，在所述硅芯片放置区域的周边区域配置有多个第一导电部， 金属盖的边缘与封装基板接触并电连接到多个第一导电部件，多个第一导电部件中的第一导电部件的至少一部分通过使用金属盖电连接到接地部件 并且接地部分布置在封装衬底上，并且被配置为对封装衬底进行接地。

公开(公告)号：US09484311B2

公开(公告)日：2016-11-01

申请号：US14570822

申请日：2014-12-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xuequan Yu ,  Yadong Bai ,  Ping Yu

IPC: H01L23/552 ,  H01L23/055 ,  H01L23/48 ,  H01L23/00 ,  H01L23/498 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/055 ,  H01L23/481 ,  H01L23/49805 ,  H01L23/66 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/16245 ,  H01L2224/1713 ,  H01L2224/17179 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00

Abstract: A chip package and a packaging method are provided, which relates to the field of communications technologies, and is invented to implement high-frequency electromagnetic interference shielding and effectively improve chip performance. The package includes a package substrate and a metal cap covering the package substrate, where a silicon chip placement area is arranged on an upper surface of the package substrate, multiple first conductive parts are arranged in a peripheral area of the silicon chip placement area, and an edge of the metal cap is in contact with the package substrate and electrically connected to the multiple first conductive parts, where at least a portion of first conductive parts in the multiple first conductive parts are electrically connected to a grounding part by using the metal cap, and the grounding part is arranged on the package substrate, and configured to ground the package substrate.

Abstract translation: 提供了与通信技术领域相关的芯片封装和封装方法，并且被发明以实现高频电磁干扰屏蔽并有效地提高芯片性能。 所述封装包括封装基板和覆盖所述封装基板的金属盖，在所述封装基板的上表面上配置有硅芯片放置区域，在所述硅芯片放置区域的周边区域配置有多个第一导电部， 金属盖的边缘与封装基板接触并电连接到多个第一导电部件，多个第一导电部件中的第一导电部件的至少一部分通过使用金属盖电连接到接地部件 并且接地部分布置在封装衬底上，并且被配置为对封装衬底进行接地。

公开(公告)号：US20150305210A1

公开(公告)日：2015-10-22

申请号：US14687511

申请日：2015-04-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xuequan Yu ,  Lin Yang ,  Yadong Bai

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K9/0028 ,  H01L23/10 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16151 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/164 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/0236 ,  H05K1/181

Abstract: An electronic component package structure and an electronic device are provided. The electronic component package structure includes at least: a substrate having a set attachment area for attaching an electronic component; a conductive lid having a top and a sidewall that extends toward the substrate, where one side of the sidewall close to the substrate has a bonding end, where the bonding end bonds the conductive lid to the substrate by using a non-conductive adhesive, and the conductive lid bonded to the substrate encloses the attachment area and forms a shielding space over the attachment area; and the non-conductive adhesive is located between the substrate and the bonding end, and has a dielectric constant not less than 7 and a coating thickness not greater than 0.07 millimeters (mm). With the present invention, an Electromagnetic Interference (EMI) shielding effect of the shielding space can be improved.

Abstract translation: 提供电子部件封装结构和电子设备。 电子部件封装结构至少包括：具有用于附接电子部件的固定附接区域的基板; 导电盖，具有朝向基板延伸的顶部和侧壁，其中靠近基板的侧壁的一侧具有接合端，其中结合端通过使用非导电粘合剂将导电盖结合到基板，以及 结合到基板的导电盖包围附接区域并在附接区域上形成屏蔽空间; 并且非导电性粘合剂位于基板和接合端之间，并且具有不小于7的介电常数和不大于0.07毫米（mm）的涂层厚度。 利用本发明，可以提高屏蔽空间的电磁干扰（EMI）屏蔽效果。