公开(公告)号：US09484311B2

公开(公告)日：2016-11-01

申请号：US14570822

申请日：2014-12-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xuequan Yu ,  Yadong Bai ,  Ping Yu

IPC: H01L23/552 ,  H01L23/055 ,  H01L23/48 ,  H01L23/00 ,  H01L23/498 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/055 ,  H01L23/481 ,  H01L23/49805 ,  H01L23/66 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/16245 ,  H01L2224/1713 ,  H01L2224/17179 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00

Abstract: A chip package and a packaging method are provided, which relates to the field of communications technologies, and is invented to implement high-frequency electromagnetic interference shielding and effectively improve chip performance. The package includes a package substrate and a metal cap covering the package substrate, where a silicon chip placement area is arranged on an upper surface of the package substrate, multiple first conductive parts are arranged in a peripheral area of the silicon chip placement area, and an edge of the metal cap is in contact with the package substrate and electrically connected to the multiple first conductive parts, where at least a portion of first conductive parts in the multiple first conductive parts are electrically connected to a grounding part by using the metal cap, and the grounding part is arranged on the package substrate, and configured to ground the package substrate.

Abstract translation: 提供了与通信技术领域相关的芯片封装和封装方法，并且被发明以实现高频电磁干扰屏蔽并有效地提高芯片性能。 所述封装包括封装基板和覆盖所述封装基板的金属盖，在所述封装基板的上表面上配置有硅芯片放置区域，在所述硅芯片放置区域的周边区域配置有多个第一导电部， 金属盖的边缘与封装基板接触并电连接到多个第一导电部件，多个第一导电部件中的第一导电部件的至少一部分通过使用金属盖电连接到接地部件 并且接地部分布置在封装衬底上，并且被配置为对封装衬底进行接地。

公开(公告)号：US20150102473A1

公开(公告)日：2015-04-16

申请号：US14570822

申请日：2014-12-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xuequan Yu ,  Yadong Bai ,  Ping Yu

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/055 ,  H01L23/48

CPC classification number: H01L23/552 ,  H01L23/055 ,  H01L23/481 ,  H01L23/49805 ,  H01L23/66 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/16245 ,  H01L2224/1713 ,  H01L2224/17179 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00

Abstract: A chip package and a packaging method are provided, which relates to the field of communications technologies, and is invented to implement high-frequency electromagnetic interference shielding and effectively improve chip performance. The package includes a package substrate and a metal cap covering the package substrate, where a silicon chip placement area is arranged on an upper surface of the package substrate, multiple first conductive parts are arranged in a peripheral area of the silicon chip placement area, and an edge of the metal cap is in contact with the package substrate and electrically connected to the multiple first conductive parts, where at least a portion of first conductive parts in the multiple first conductive parts are electrically connected to a grounding part by using the metal cap, and the grounding part is arranged on the package substrate, and configured to ground the package substrate.

Abstract translation: 提供了与通信技术领域相关的芯片封装和封装方法，并且被发明以实现高频电磁干扰屏蔽并有效地提高芯片性能。 所述封装包括封装基板和覆盖所述封装基板的金属盖，在所述封装基板的上表面上配置有硅芯片放置区域，在所述硅芯片放置区域的周边区域配置有多个第一导电部， 金属盖的边缘与封装基板接触并电连接到多个第一导电部件，多个第一导电部件中的第一导电部件的至少一部分通过使用金属盖电连接到接地部件 并且接地部分布置在封装衬底上，并且被配置为对封装衬底进行接地。