公开(公告)号：US12207447B2

公开(公告)日：2025-01-21

申请号：US18151566

申请日：2023-01-09

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yuping Hong ,  Xiaowei Hui ,  Meng Wang

IPC: H05K7/20

Abstract: A heat sink is provided. The heat sink includes a base board and a rib board. The base board includes a base board cavity, and the rib board includes a rib board cavity. The base board includes a first board face and a second board face. A groove is disposed on the second board face. The base board cavity is filled with a liquid working medium. The rib board includes at least one partition board. The at least one partition board separates the rib board cavity into at least two chambers. The at least two chambers are separately connected to the base board cavity. One end of the rib board is inserted in the base board through the groove. One end of the partition board is located in the base board. A communication device that includes the heat sink is also provided.

公开(公告)号：US20210045263A1

公开(公告)日：2021-02-11

申请号：US17079408

申请日：2020-10-23

Applicant: HUAWEI TECHNOLOGIES CO.,LTD.

Inventor： Xiaowei Hui ,  Yuping Hong ,  Wei Chen

IPC: H05K7/20

Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.

公开(公告)号：US11330737B2

公开(公告)日：2022-05-10

申请号：US17079408

申请日：2020-10-23

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xiaowei Hui ,  Yuping Hong ,  Wei Chen

IPC: H05K7/20

Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.

公开(公告)号：US11144101B2

公开(公告)日：2021-10-12

申请号：US16529075

申请日：2019-08-01

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Xiaowei Hui ,  Xiangyang Yang ,  Shaoxin Zhou

IPC: G06F1/20 ,  F28D15/02 ,  H05K7/20

Abstract: An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

公开(公告)号：US10088879B2

公开(公告)日：2018-10-02

申请号：US15508890

申请日：2014-06-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Nanbo Kang ,  Jie Zou ,  Xiaowei Hui

IPC: G06F1/20 ,  F28D15/02 ,  H01L23/427 ,  F28D15/04

Abstract: An intelligent terminal heat dissipation apparatus and an intelligent terminal are disclosed. The intelligent terminal heat dissipation apparatus includes at least one flexible heat pipe, where two ends of the flexible heat pipe are condensation ends, the middle of the flexible heat pipe is an evaporation end, the condensation end includes one or more heat pipe rigid parts and one or more heat pipe flexible parts, the one or more heat pipe rigid parts and the one or more heat pipe flexible parts of the condensation end are arranged alternately, the evaporation end includes at least one heat pipe rigid part, and an intelligent terminal body is mounted on the evaporation end. By using the intelligent terminal heat dissipation apparatus, flexible heat dissipation is implemented for a bendable device.

公开(公告)号：US20170102745A1

公开(公告)日：2017-04-13

申请号：US15311927

申请日：2014-06-04

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Xiaowei Hui ,  Xiangyang Yang ,  Shaoxin Zhou

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  F28D15/0275 ,  G06F1/203 ,  H05K7/20336 ,  H05K7/2039

Abstract: An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

公开(公告)号：US11789504B2

公开(公告)日：2023-10-17

申请号：US17474564

申请日：2021-09-14

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Xiaowei Hui ,  Xiangyang Yang ,  Shaoxin Zhou

IPC: G06F1/20 ,  F28D15/02 ,  H05K7/20

CPC classification number: G06F1/20 ,  F28D15/0275 ,  G06F1/203 ,  H05K7/2039 ,  H05K7/20336

Abstract: An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).

公开(公告)号：US20190354147A1

公开(公告)日：2019-11-21

申请号：US16529075

申请日：2019-08-01

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Xiaowei Hui ,  Xiangyang Yang ,  Shaoxin Zhou

IPC: G06F1/20 ,  F28D15/02 ,  H05K7/20

Abstract: An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

公开(公告)号：US20190327857A1

公开(公告)日：2019-10-24

申请号：US16458711

申请日：2019-07-01

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaowei Hui ,  Yuping Hong ,  Wei Chen

IPC: H05K7/20

Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.

公开(公告)号：US20220004235A1

公开(公告)日：2022-01-06

申请号：US17474564

申请日：2021-09-14

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Xiaowei Hui ,  Xiangyang Yang ,  Shaoxin Zhou

IPC: G06F1/20 ,  F28D15/02 ,  H05K7/20

Abstract: An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).