公开(公告)号：US20240121887A1

公开(公告)日：2024-04-11

申请号：US18477863

申请日：2023-09-29

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Xiaojing Liao

IPC: H05K1/02

CPC classification number: H05K1/024 ,  H05K1/0298 ,  H05K2201/012 ,  H05K2201/10181 ,  H05K2201/10356

Abstract: A package structure includes a protection structure, a circuit board, and a chip. The circuit board includes a first cabling layer, a dielectric layer, and a second cabling layer that are laminated. The protection structure is disposed inside the dielectric layer. The protection structure is configured to electrically connect the first cabling layer to the second cabling layer, and the chip is electrically connected to the first cabling layer or the second cabling layer. When the chip is short-circuited, the protection structure blows first.

公开(公告)号：US20240321719A1

公开(公告)日：2024-09-26

申请号：US18735475

申请日：2024-06-06

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Xiaojing Liao

IPC: H01L23/498 ,  H01L23/28 ,  H01L23/36

CPC classification number: H01L23/49838 ,  H01L23/28 ,  H01L23/36

Abstract: An outer surface of a packaged device includes a bottom surface and a plurality of side surfaces. The bottom surface of the packaged device faces a circuit board, and an area of at least one side surface is greater than that of the bottom surface. The packaged device includes a chip module, a package body, a first interface, and a second interface. The first interface of the packaged device is configured to connect to the circuit board. The second interface of the packaged device is configured to connect to a surface-mount device, and is disposed on at least one side surface.

公开(公告)号：US12075558B2

公开(公告)日：2024-08-27

申请号：US17559763

申请日：2021-12-22

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Zhaozheng Hou ,  Xiaojing Liao ,  Chao Shen ,  Dongxing Wang

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/182 ,  H05K1/185 ,  H05K7/20218

Abstract: The present disclosure relates to the field of printed circuit board technologies. A printed circuit board with good heat dissipation performance is provided and includes a substrate serving as a board body of the printed circuit board, a heating component embedded in the substrate, and a cooling liquid channel disposed in the substrate. The cooling liquid channel is disposed in the printed circuit board, and passes around the heating component to exchange heat with the heating component, so that a heat dissipation path is shortened and heat dissipation efficiency is improved, thereby quickening heat dissipation of the printed circuit board, and prolonging a service life of the printed circuit board.