公开(公告)号：US08606057B1

公开(公告)日：2013-12-10

申请号：US13685193

申请日：2012-11-26

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Mario Cesana ,  Jukka Alasirnio ,  Philippe Bouchilloux ,  Susanne Westenhoefer ,  Jens Geiger

IPC: G02B6/12

CPC classification number: H05K3/4697 ,  H01L23/49833 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L31/0203 ,  H01L2224/04026 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K1/182 ,  H05K1/183 ,  H05K2201/10121 ,  H05K2203/063 ,  H01L2224/83 ,  H01L2924/00

Abstract: Opto-electronic modules include conductive wiring and connections that can facilitate integrating the modules into an external device. Some opto-electronic modules include an opto-electronic stack that includes at least one lens and an opto-electronic element. Conductive paths can extend from the bottom to the top of the module. The conductive paths can include conductive pads on the surface of the opto-electronic element, as well as wiring at least partially embedded in a substrate and walls of a housing for the opto-electronic stack. Conductive connections can be disposed between a top surface of the substrate and the bottom surface of the walls such that the conductive connections electrically connect the second wiring to the first wiring and to the conductive pads on the surface of the opto-electronic element. The modules can be fabricated, for example, in wafer-level processes so that multiple opto-electronic modules can be manufactured at the same time.

Abstract translation: 光电模块包括导电布线和连接，可以方便将模块集成到外部设备中。 一些光电模块包括包括至少一个透镜和光电元件的光电堆叠。 导电路径可以从模块的底部延伸到顶部。 导电路径可以包括在光电子元件的表面上的导电焊盘，以及至少部分地嵌入基板的布线和用于光电叠层的壳体的壁。 导电连接可以设置在基板的顶表面和壁的底表面之间，使得导电连接将第二布线电连接到第一布线和光电元件表面上的导电垫。 模块可以例如在晶片级处理中制造，从而可以同时制造多个光电模块。

公开(公告)号：US08791489B2

公开(公告)日：2014-07-29

申请号：US13827264

申请日：2013-03-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhoefer ,  Simon Gubser

IPC: H01L33/00 ,  H01L31/12

CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，该光发射器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。

公开(公告)号：US20130264586A1

公开(公告)日：2013-10-10

申请号：US13827264

申请日：2013-03-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhoefer ,  Simon Gubser

IPC: H01L31/12

CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，所述发光器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。