公开(公告)号：US10243111B2

公开(公告)日：2019-03-26

申请号：US15631361

申请日：2017-06-23

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Qichuan Yu ,  Simon Gubser ,  Bojan Tesanovic ,  Xu Yi ,  Eunice Ho Hui Ong ,  Hongyuan Liu ,  Ji Wang ,  Edmund Koon Tian Lua ,  Myo Paing ,  Jian Tang ,  Ming Jie Lee

IPC: H01L33/48 ,  H01L25/16 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

公开(公告)号：US20180006192A1

公开(公告)日：2018-01-04

申请号：US15631361

申请日：2017-06-23

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Qichuan Yu ,  Simon Gubser ,  Bojan Tesanovic ,  Xu Yi ,  Eunice Ho Hui Ong ,  Hongyuan Liu ,  Ji Wang ,  Edmund Koon Tian Lua ,  Myo Paing ,  Jian Tang ,  Ming Jie Lee

IPC: H01L33/48 ,  H01L31/02 ,  H01L33/54 ,  H01L31/0232 ,  H01L33/62 ,  H01L25/16 ,  H01L33/58 ,  H01L31/0203

CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

公开(公告)号：US20180003927A1

公开(公告)日：2018-01-04

申请号：US15631395

申请日：2017-06-23

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Guo Xiong Wu ,  Ming Jie Lee ,  Simon Gubser ,  Qichuan Yu ,  Joon Heng Tan

IPC: G02B13/00 ,  G02B5/20 ,  H01S5/00 ,  G02B7/00 ,  H01L31/0203 ,  H01L33/58 ,  H01L33/52 ,  H01L33/50 ,  H01L31/0232 ,  H01S5/022 ,  H01L27/146

Abstract: The present disclosure describes optical and optoelectronic assemblies that, in some cases, include screen-printed micro-spacers, as well as methods for manufacturing such assemblies and modules. For example, micro-spacers can be applied on a first optical element layer, and a second optical element layer can be provided on the first micro-spacers. By providing the second optical element layer on the first micro-spacers, the second optical element layer and the first optical element layer can be separated from one another by air or vacuum gaps each of which is laterally surrounded by a portion of the first micro-spacers.