公开(公告)号：US20160241749A1

公开(公告)日：2016-08-18

申请号：US15024133

申请日：2014-09-17

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasimiö ,  Stephan Heimgartner

IPC: H04N5/225 ,  H01L27/146

CPC classification number: H04N5/2257 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2924/19105 ,  H04N5/2252 ,  H05K3/284 ,  H01L2924/00014

Abstract: Compact camera module can include auxiliary spacers to facilitate use of dam-and-fill encapsulation techniques. An encapsulant disposed on side edges of the auxiliary spacer can close off a gap between the auxiliary spacer and a support on which an image sensor is mounted so as to substantially seal off an area in which bond wires or other components are located. In some cases, the thickness of a transmissive substrate in the module can be reduced near its periphery to provide more head room for the bond wires, which can result in a smaller overall footprint for the module.

Abstract translation: 紧凑型相机模块可以包括辅助间隔件，以便于使用阻塞和灌装封装技术。 设置在辅助间隔物的侧边缘上的密封剂可以封闭辅助间隔件和安装有图像传感器的支撑件之间的间隙，从而基本上密封接合线或其它部件所在的区域。 在一些情况下，模块中的透射基板的厚度可以在其周边附近减小以为接合线提供更多的头部空间，这可以导致模块的更小的总体占地面积。