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公开(公告)号：US20240107656A1
公开(公告)日：2024-03-28
申请号：US18372828
申请日：2023-09-26
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Chaojun DENG , Fei MA , Wei FANG , Zhiwen YANG , Chungang LI , Shun HAO
CPC classification number: H05K1/0203 , G02B6/4269 , G02B6/4284 , H05K1/181 , H05K7/023 , H05K7/026 , H05K7/20409
Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.
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公开(公告)号：US20210212193A1
公开(公告)日：2021-07-08
申请号：US17155324
申请日：2021-01-22
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Chaojun DENG , Fei MA , Wei FANG , Zhiwen YANG , Chungang LI , Shun HAO
Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.
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公开(公告)号：US20230288647A1
公开(公告)日：2023-09-14
申请号：US18184143
申请日：2023-03-15
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Hualiang SHI , Banghong HU , Wei FANG , Chungang LI , Yiguo QI , Juanjuan CAO
IPC: G02B6/38
CPC classification number: G02B6/3885 , G02B6/3882
Abstract: Embodiments of this application provide an optical fiber ferrule, where n rows of optical fiber holes are symmetrically distributed on a mating end face of the ferrule, n>=3, and n is an odd number. Based on the layout design of optical fiber holes on the optical fiber ferrule, this application provides an optical fiber connector that includes a plurality of rows of optical fiber holes and that is compatible with one row and a relatively small number of rows of optical fiber holes, so that an optical fiber connector with a large number of cores can be forward compatible with an optical fiber connector with a small number of cores, thereby improving expandability and compatibility of the optical fiber ferrule.
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公开(公告)号：US20210018701A1
公开(公告)日：2021-01-21
申请号：US17037355
申请日：2020-09-29
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Hualiang SHI , Banghong HU , Wei FANG , Chungang LI , Yiguo QI , Juanjuan CAO
IPC: G02B6/38
Abstract: Embodiments of this application provide an optical fiber ferrule, where n rows of optical fiber holes are symmetrically distributed on a mating end face of the ferrule, n>=3, and n is an odd number. Based on the layout design of optical fiber holes on the optical fiber ferrule, this application provides an optical fiber connector that includes a plurality of rows of optical fiber holes and that is compatible with one row and a relatively small number of rows of optical fiber holes, so that an optical fiber connector with a large number of cores can be forward compatible with an optical fiber connector with a small number of cores, thereby improving expandability and compatibility of the optical fiber ferrule.
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