公开(公告)号：US09661756B1

公开(公告)日：2017-05-23

申请号：US14455642

申请日：2014-08-08

Applicant: Flextronics AP, LLC

Inventor： Jennifer Nguyen ,  David Geiger ,  Anwar Mohammed ,  Murad Kurwa

IPC: H05K1/09 ,  H05K3/24 ,  H05K1/11 ,  H05K3/30 ,  H05K3/40

CPC classification number: H05K3/244 ,  G06K19/07754 ,  H01L23/5386 ,  H01L24/65 ,  H01L25/00 ,  H01L2924/38 ,  H01M6/40 ,  H04B1/3816 ,  H05K1/097 ,  H05K1/111 ,  H05K3/30 ,  H05K3/40

Abstract: Embodiments of the present invention relate to nano-copper pillar interconnects. Nano-copper material is a mixture of nano-copper particles and one or more organic fluxes. In some embodiments, the one or more organic fluxes include organic solvents that help bind the nano-copper particles together and allow the nano-copper material to be printable. The nano-copper material is applied onto bond pads on a printed circuit board (PCB) via a printing process, a dipping process or the like, to form nano-copper covered PCB bond pads. A component can thereafter be coupled with the PCB at the nano-copper covered PCB bond pads. What is left when the solvents evaporate are nano-copper pillar interconnects that form, coupling the component with the PCB bond pads. The nano-copper pillar interconnects are of pure copper.

公开(公告)号：US09397065B1

公开(公告)日：2016-07-19

申请号：US14468216

申请日：2014-08-25

Applicant: Flextronics AP, LLC

Inventor： Jennifer Nguyen ,  David Geiger ,  Ranilo Aranda ,  Jonas Sjoberg ,  Anwar Mohammed ,  Murad Kurwa

IPC: H01L23/544 ,  H01L23/00 ,  H01L25/00 ,  H01L23/538

CPC classification number: H05K3/244 ,  G06K19/07754 ,  H01L23/5386 ,  H01L24/65 ,  H01L25/00 ,  H01L2924/38 ,  H01M6/40 ,  H04B1/3816 ,  H05K1/097 ,  H05K1/111 ,  H05K3/30 ,  H05K3/40

Abstract: Embodiments of the present invention relate to a fixture design for pre-attachment package on package component assembly. The fixture design includes a plurality of pockets arranged in a N×M array. The plurality of pockets is sized to receive bottom packages. The fixture design includes global fiducials that are used to locate positions of the pockets on the fixture, and sets of local fiducials, with each set being specific to one of the pockets and used to refine the position of the location of a corresponding pocket. Each of the pockets can include one or more ear cuts for easy component placement and component removal. The fixture design can include a vacuum port for coupling with a vacuum source for drawing a vacuum to hold the bottom packages down. The fixture design can also include a cover that is used with the fixture to keep the components from being disturbed.

Abstract translation: 本发明的实施例涉及一种用于包装部件组件上的预附接包装的夹具设计。 夹具设计包括以N×M阵列排列的多个口袋。 多个口袋的尺寸适于接纳底部包装。 夹具设计包括用于定位夹具上的凹穴的位置的全局基准和局部基准的集合，其中每一组特定于其中一个凹穴并且用于细化相应凹穴的位置的位置。 每个口袋可以包括一个或多个耳朵切口，便于元件放置和元件移除。 夹具设计可以包括用于与真空源耦合的真空端口，用于抽真空以将底部包装件向下保持。 夹具设计还可以包括与夹具一起使用以防止部件受到干扰的盖子。