公开(公告)号：US09538666B2

公开(公告)日：2017-01-03

申请号：US14218803

申请日：2014-03-18

Applicant: Electronics and Telecommunications Research Institute

Inventor： Kwang-Seong Choi ,  Hyun-cheol Bae ,  Haksun Lee ,  Yong Sung Eom

IPC: H05K7/10 ,  H05K3/34 ,  H01L23/48 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K3/3436 ,  H01L23/48 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/189 ,  H05K2201/10128 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

Abstract: Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.

Abstract translation: 提供了一种电子设备的接合结构，包括：在第一方向上延伸并沿第二方向布置在具有拉伸性的可拉伸显示面板上的第一电极，第二电极沿第一方向延伸并沿基板上的第二方向布置， 第一电极和介于第一电极和第二电极之间的焊接接合部分，在第二方向上彼此面对，并且在第一方向上构成多行。

公开(公告)号：US09006037B2

公开(公告)日：2015-04-14

申请号：US13904572

申请日：2013-05-29

Applicant: Electronics and Telecommunications Research Institute

Inventor： Kwang-Seong Choi ,  Yong Sung Eom ,  Hyun-cheol Bae ,  Haksun Lee

IPC: H01L21/00 ,  H01L23/00

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/1152 ,  H01L2224/1181 ,  H01L2224/13022 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2924/07802 ,  H01L2924/15788 ,  H01L2924/3841 ,  H05K3/3484 ,  H05K2201/0367 ,  H05K2203/043 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029

Abstract: Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.

Abstract translation: 提供了形成凸块的方法和具有该凸块的半导体器件。 该方法可以包括提供具有衬垫的衬底，形成覆盖焊盘的凸块制作器层并且包括树脂和焊料颗粒，热处理凸块制造器层以将焊料颗粒聚集到焊盘上，去除树脂以暴露聚集的焊料 颗粒，形成树脂层以覆盖聚集的焊料颗粒，并且回流聚集的焊料颗粒以在焊盘上形成凸块。